SN74AUP1G97DSFR

Low-Power Configurable Multiple-Function Gate
part number has RoHS
1 : $0.1404

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Dasenic Part Number
30E168-DS
Manufacturer
Manufacturer Part #
SN74AUP1G97DSFR

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12000 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
6-XFDFN Tape & Reel (TR) Cut Tape (CT) Dasenic-Reel®
Quantity
Unit Price
$ 0.1404
Total
$ 0.14

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerTexas Instruments
Integrated Circuits (ICs)Configurable Multiple Function Gates
Product StatusActive
Operating Temperature-40°C ~ 85°C
Mounting TypeSurface Mount
Package / Case6-XFDFN
Output TypeSingle-Ended
Supplier Device Package6-SON (1x1)
Number of Circuits1
Voltage - Supply0.8V ~ 3.6V
Number of Inputs3
Logic TypeConfigurable Multiple Function
Current - Output High, Low4mA, 4mA
Schmitt Trigger InputYes
Series74AUP
Base Product Number74AUP1G97
PackagingDasenic-Reel®
PackagingCut Tape (CT)
PackagingTape & Reel (TR)

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating1 (Unlimited, 30°C/85%RH)
REACH StatusREACH Unaffected
US ECCNEAR99
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). The SN74AUP1G97 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All inputs can be connected to VCC or GND. The device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

In Stock: 12000

MOQ
1PCS
Packaging
6-XFDFN Tape & Reel (TR) Cut Tape (CT) Dasenic-Reel®
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 0.1404
Total
$ 0.14

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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