XPC850SRVR50BU

IC MPU MPC8XX 50MHZ 256BGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
F70AB6-DS
Manufacturer
Manufacturer Part #
XPC850SRVR50BU

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40 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
256-BBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerNXP Semiconductors
Integrated Circuits (ICs)Embedded Microprocessors
Product StatusObsolete
Operating Temperature0°C ~ 95°C (TA)
Mounting TypeSurface Mount
Package / Case256-BBGA
Supplier Device Package256-PBGA (23x23)
Voltage - I/ O3.3V
Speed50MHz
Core ProcessorMPC8xx
Number of Cores/ Bus Width1 Core, 32-Bit
Co- Processors/ D S PCommunications; CPM
R A M ControllersDRAM
Graphics AccelerationNo
Ethernet10Mbps (1)
U S BUSB 1.x (1)
SeriesMPC8xx
Base Product NumberXPC85
Additional InterfacesHDLC/SDLC, I²C, IrDA, PCMCIA-ATA, TDM, UART/USART
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN3A001A3
HTS US8542.31.0001
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XPC850SRVR50BU is a high-performance integrated circuit (IC) component manufactured by Freescale Semiconductor (now NXP Semiconductors). It belongs to the PowerQUICC family of microprocessors specifically designed for embedded systems, networking, and telecommunications applications. This IC has numerous key features that make it suitable for these applications. Below is an overview along with some of its key features: 1. Architecture and Performance: - The XPC850SRVR50BU is based on the PowerPC architecture, which provides a high-performance and efficient processing capability. - It operates at a clock frequency of 50 MHz, enabling fast data processing and execution of complex algorithms. - The IC is built using a 0.35-micron complementary metal-oxide-semiconductor (CMOS) process technology, contributing to its power-efficient design. 2. Integrated Peripherals: - The component offers a range of integrated peripherals, including an enhanced communications controller (SCC), a quad integrated communications controller (QUICC), and a time processing unit (TPU). - These peripherals enable the IC to handle various communication protocols such as Ethernet, UART, HDLC, and SPI, making it suitable for networking and telecommunications applications. 3. Memory and Interface: - The XPC850SRVR50BU supports various memory types, including static random-access memory (SRAM), dynamic random-access memory (DRAM), and flash memory. - It features a 32-bit external bus interface, providing connectivity to external memory and peripheral components. - The IC uses Motorola's standard peripheral interface (SPI) for ease of interfacing with other devices. 4. Power Management: - The IC incorporates power management features to optimize power consumption in embedded systems. - It supports multiple low-power modes and can enter a sleep mode when idle, conserving energy and improving overall system efficiency. - The power management features help reduce the system's overall power consumption and extend the battery life in portable applications. 5. Development Tools and Software Support: - Development tools and software support play a crucial role in designing and programming applications for the XPC850SRVR50BU. - NXP Semiconductors provides a comprehensive set of development tools, including compilers, debuggers, and integrated development environments (IDEs), to facilitate the software development process. - The IC is supported by various operating systems and real-time operating systems (RTOS), offering flexibility to developers for choosing the suitable software environment for their application. In conclusion, the XPC850SRVR50BU is a highly capable IC component designed for networking, telecommunications, and embedded systems. Its PowerPC-based architecture, high clock frequency, integrated peripherals, memory and interface flexibility, power management capabilities, and robust development tools make it an ideal choice for various applications that require reliable and efficient processing.

In Stock: 40

MOQ
1PCS
Packaging
256-BBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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