MT47H128M8CF-3 IT:H

IC DRAM 1GBIT PARALLEL 60FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
B2218D-DS
Manufacturer
Manufacturer Part #
MT47H128M8CF-3 IT:H

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60 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
60-TFBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerMicron Technology
Integrated Circuits (ICs)Memory
Product StatusObsolete
Operating Temperature-40°C ~ 95°C (TC)
Mounting TypeSurface Mount
Package / Case60-TFBGA
TechnologySDRAM - DDR2
Supplier Device Package60-FBGA (8x10)
Memory Size1Gbit
Memory TypeVolatile
Voltage - Supply1.7V ~ 1.9V
Clock Frequency333 MHz
Access Time450 ps
Memory FormatDRAM
Memory InterfaceParallel
Write Cycle Time - Word, Page15ns
Base Product NumberMT47H128M8
Memory Organization128M x 8
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCNEAR99
HTS US8542.32.0032
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component MT47H128M8CF-3IT:H is a high-speed DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip produced by Micron Technology. It is primarily used in computer systems, servers, and other electronic devices that require high-performance memory modules. Here is an overview of the key features of this IC component: 1. Memory Capacity: The MT47H128M8CF-3IT:H has a memory capacity of 1 Gigabit (Gbit), which is equivalent to 128 Megabytes (MB). This capacity allows for storing a significant amount of data for efficient processing. 2. DDR3 SDRAM Technology: This IC component utilizes DDR3 SDRAM technology, which provides faster and more efficient data transfer rates compared to its predecessors. DDR3 SDRAM offers a high bandwidth and low latency, resulting in improved system performance. 3. Speed and Timing: The MT47H128M8CF-3IT:H operates with a speed grade of 1666 megatransfers per second (MT/s). It has a CAS latency (CL) of 11 cycles, ensuring quick data access and retrieval. 4. Organization and Architecture: The IC component is organized as 8 banks of 16 Megabytes (MB) each, employing an 8-bit data bus. It follows a x8 architecture, meaning it can transfer 8 bits of data at a time

In Stock: 60

MOQ
1PCS
Packaging
60-TFBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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