LFSC3GA25E-5FF1020C

IC FPGA 476 I/O 1020BGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
9B0DD2-DS
Manufacturer Part #
LFSC3GA25E-5FF1020C

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27 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1020-BBGA, FCBGA Tray

Quantity

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ManufacturerLattice Semiconductor
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1020-BBGA, FCBGA
Supplier Device Package1020-OFCBGA (33x33)
Voltage - Supply0.95V ~ 1.26V
Number of I/ O476
Number of L A Bs/ C L Bs6250
Number of Logic Elements/ Cells25000
Total R A M Bits1966080
SeriesSC
Base Product NumberLFSC3GA25
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A991D
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component LFSC3GA25E-5FF1020C is a high-performance, low-power field programmable gate array (FPGA) device. It is manufactured by Lattice Semiconductor Corporation and is part of their ECP3 family of FPGAs. This particular device, LFSC3GA25E-5FF1020C, offers a range of features and capabilities that make it suitable for various applications. Key Features: 1. FPGA Architecture: The LFSC3GA25E-5FF1020C is built on a Lattice ECP3 FPGA architecture. This architecture provides a balance between performance and low-power consumption, making it ideal for applications that require high processing capability with low energy consumption. 2. Logic Capacity: This FPGA offers a logic capacity of up to 24,128 Look Up Tables (LUTs). LUTs are fundamental building blocks of digital circuits and are used to implement various logic functions. 3. Embedded Memory: The LFSC3GA25E-5FF1020C incorporates on-chip memory resources, including up to 540 Kbits of Single-Port Block RAM and up to 10 embedded multipliers. These resources enable the implementation of complex algorithms and data processing tasks within the FPGA itself, reducing the need for external memory. 4. High-Speed I/O: The device features 26 high-speed differential I/O pairs capable of supporting various high-speed protocols such as PCIe, DDR3, and Gigabit Ethernet

In Stock: 27

MOQ
1PCS
Packaging
1020-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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