5SGSMD4E1H29I2WN

IC FPGA 360 I/O 780HBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
0DBCBA-DS
Manufacturer
Manufacturer Part #
5SGSMD4E1H29I2WN

Customer Reference

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40 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-HBGA (33x33)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O360
Number of L A Bs/ C L Bs135840
Number of Logic Elements/ Cells360000
Total R A M Bits19456000
SeriesStratix® V GS
Base Product Number5SGSMD4
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating4 (72 Hours)
US ECCNOBSOLETE
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component 5SGSMD4E1H29I2WN is an advanced field-programmable gate array (FPGA) developed by Intel. Here is an overview of this IC component along with its key features: 1. Overview: The 5SGSMD4E1H29I2WN FPGA is a member of the Intel Stratix 5 series and is built using 28nm process technology. It is designed to provide high-performance and high-capacity programmable logic solutions for a wide range of applications. 2. Key Features: a. Logic Capacity: This FPGA offers a maximum logic capacity of 422,400 logic elements (LEs), making it suitable for complex designs requiring significant computational capabilities. b. Transceivers: It includes 29 high-speed transceivers, enabling the transmission of data at fast rates. These transceivers support various protocols like PCIe, SATA, Gigabit Ethernet, and more. c. DSP Blocks: The 5SGSMD4E1H29I2WN FPGA contains 832 embedded digital signal processing (DSP) blocks, which are dedicated hardware components optimized for performing complex mathematical operations efficiently. These DSP blocks enhance the device's capability to handle intense signal processing tasks. d. Memory Resources: It offers up to 16.1 Mb of embedded memory, which can be configured as either on-chip memory or as dedicated memory blocks

In Stock: 40

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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