XCZU19EG-1FFVB1517I

IC SOC CORTEX-A53 1517FCBGA
part number has RoHS
1 : $13425.0000

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Dasenic Part Number
5F8651-DS
Manufacturer
Manufacturer Part #
XCZU19EG-1FFVB1517I

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1021 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FCBGA (40x40)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O644
Speed500MHz, 600MHz, 1.2GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 1143K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU19
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU19EG-1FFVB1517I is a powerful IC component developed by Xilinx, a leader in the field of programmable logic devices. This particular chip belongs to the Xilinx Zynq UltraScale+ family and offers a wide range of advanced features suitable for various applications. Here is an overview of its key features: 1. Processing System: The XCZU19EG integrates a quad-core ARM Cortex-A53 processor with a clock speed of up to 1.5GHz. It also incorporates a dual-core ARM Cortex-R5 processor operating at up to 600MHz. This combination allows for efficient and reliable processing capabilities. 2. Programmable Logic: The chip includes programmable logic of up to 1.2 million logic cells, making it extremely flexible for implementing various digital functions and designs. This feature enables it to adapt to different application requirements and allows for a higher degree of customization. 3. UltraScale+ Architecture: The UltraScale+ architecture offers improved performance, superior power efficiency, and higher bandwidth compared to previous generations. The XCZU19EG leverages this architecture to deliver enhanced processing capabilities and optimize power consumption. 4. High-Speed Interfaces: The XCZU19EG provides a wide array of high-speed interfaces to facilitate seamless communication with external devices and subsystems. It includes up to 256x general-purpose I/O pins for direct connectivity, multiple USB 3.0 and Gigabit Ethernet ports for fast data transfer, and numerous Serial Peripheral Interfaces (SPI), Inter-Integrated Circuit (I2C), and UART channels. 5. Memory and Storage: This IC component incorporates a generous amount of memory resources. It includes up to 4GB of DDR4 or DDR4 ECC-lined memory for data storage and processing requirements. Additionally, it provides multiple high-speed interfaces such as Quad SPI, eMMC, and SD/SDIO for external storage devices. 6. AI Acceleration: The XCZU19EG integrates AI capabilities with dedicated accelerators for machine learning tasks. These accelerators enable faster inferencing and training of neural networks, making the chip suitable for applications involving artificial intelligence, computer vision, and deep learning. 7. Security Features: Xilinx has prioritized security in their UltraScale+ devices, and the XCZU19EG is no exception. It incorporates numerous security mechanisms such as secure boot, encrypted bitstream storage, AES-256 encryption engines, tamper detection, and various TrustZone technologies to ensure system integrity and data protection. 8. Versatile Development Environment: Xilinx provides a comprehensive development ecosystem for designing and implementing applications using the XCZU19EG. It includes Vivado Design Suite for FPGA development, PetaLinux tools for embedded software development, and a wide range of libraries, IP cores, and frameworks to expedite the design process. In conclusion, the XCZU19EG-1FFVB1517I is a highly flexible and powerful IC component that combines a processing system with ARM cores, programmable logic, various high-speed interfaces, AI acceleration, secure features, and a comprehensive development environment. These features make it suitable for a broad range of applications such as data centers, industrial automation, automotive electronics, medical devices, and more.

In Stock: 1021

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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