XCV300-5FG456C

IC FPGA 312 I/O 456FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
F72D45-DS
Manufacturer
Manufacturer Part #
XCV300-5FG456C

Customer Reference

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49 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
456-BBGA

Quantity

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ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case456-BBGA
Supplier Device Package456-FBGA (23x23)
Voltage - Supply2.375V ~ 2.625V
Number of Gates322970
Number of I/ O312
Number of L A Bs/ C L Bs1536
Number of Logic Elements/ Cells6912
Total R A M Bits65536
SeriesVirtex®
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XCV300-5FG456C is an FPGA (Field-Programmable Gate Array) IC component, manufactured by Xilinx. It offers a range of advanced features that make it suitable for a variety of applications. Here is an overview of its key features: 1. High Performance: The XCV300-5FG456C delivers impressive performance capabilities, making it ideal for applications requiring high-speed data processing. It is equipped with a large number of logic cells and DSP slices, enabling complex computations and algorithms to be implemented efficiently. 2. Flexibility: Being a field-programmable device, the XCV300-5FG456C provides significant flexibility. Users can configure the IC according to their specific requirements, making it adaptable for various applications. This flexibility also allows for easy design changes or updates without the need for hardware modifications. 3. Abundant Memory Resources: It incorporates a substantial amount of on-chip memory, including block RAMs (BRAMs) and distributed RAMs. This extensive memory capacity enables the IC to efficiently store and process large data sets, improving overall system performance. 4. Advanced I/O Capabilities: The XCV300-5FG456C offers a wide range of input/output (I/O) options, providing excellent connectivity to external devices. It supports various industry-standard interfaces, such as LVCMOS, LVTTL, SSTL, HSTL, and LVDS, ensuring seamless integration with other components or systems

In Stock: 49

MOQ
1PCS
Packaging
456-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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