OMAPL137CZKBA3

IC MPU OMAP-L1X 375MHZ 256BGA
part number has RoHS
1 : $52.8109

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Dasenic Part Number
406C84-DS
Manufacturer
Manufacturer Part #
OMAPL137CZKBA3

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2016 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
256-BGA Tray
Quantity
Unit Price
$ 52.8109
Total
$ 52.81

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerTexas Instruments
Integrated Circuits (ICs)Embedded Microprocessors
Product StatusObsolete
Operating Temperature-40°C ~ 105°C (TJ)
Mounting TypeSurface Mount
Package / Case256-BGA
Supplier Device Package256-BGA (17x17)
Voltage - I/ O1.8V, 3.3V
Speed375MHz
Core ProcessorARM926EJ-S
Number of Cores/ Bus Width1 Core, 32-Bit
Co- Processors/ D S PSignal Processing; C674x, System Control; CP15
R A M ControllersSDRAM
Graphics AccelerationNo
Display & Interface ControllersLCD
Ethernet10/100Mbps (1)
U S BUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
SeriesOMAP-L1x
Base Product NumberOMAPL137
Additional InterfacesHPI, I²C, McASP, MMC/SD, SPI, UART
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN3A991A2
HTS US8542.31.0001
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
OMAPL137CZKBA3 is an integrated circuit (IC) component that belongs to the OMAP-L1 family developed by Texas Instruments. This IC combines a digital signal processor (DSP) and an ARM processor, offering a powerful and flexible platform for a wide range of applications. Here is an overview of the key features of OMAPL137CZKBA3: 1. Dual-Core Architecture: The OMAPL137CZKBA3 consists of two cores - an ARM926EJ-S processor and a TMS320C6747 DSP. This dual-core architecture allows for efficient processing of both control and signal processing tasks, making it suitable for applications requiring a mix of real-time control and digital signal processing capabilities. 2. Enhanced DSP Performance: The TMS320C6747 DSP core is based on the C67x+ DSP architecture, offering improved performance over previous generations. It operates at a clock speed of up to 300 MHz, providing substantial processing power for demanding signal processing applications. 3. ARM926EJ-S Processor: The ARM926EJ-S core serves as the control processor in OMAPL137CZKBA3. It operates at a clock speed of up to 300 MHz and supports features such as a 16KB instruction cache, 8KB data cache, and various peripherals, enabling the execution of complex control tasks. 4. Memory and Storage: The IC includes 160KB of on-chip RAM, which is divided between the ARM and DSP cores. It also supports external memory interfaces, including DDR2 SDRAM, asynchronous memory, and NAND/NOR flash, providing flexibility and expanding the available storage capacity. 5. Connectivity Options: OMAPL137CZKBA3 offers a range of connectivity options, including an integrated Ethernet MAC and USB 2.0 controller. This allows for easy integration into wired or wireless networks and facilitates data transfer to and from external devices. 6. Peripherals and Interfaces: The IC component provides several on-chip peripherals, including I2C, SPI, UART, McBSP, and GPIO interfaces, enabling communication with external devices or sensors. Additionally, it supports audio codecs, PWM modules, and timers, adding versatility to the range of possible applications. 7. Low Power Consumption: Texas Instruments has optimized power consumption for OMAPL137CZKBA3, making it suitable for battery-powered or low-power applications. It incorporates power management features and advanced power-saving modes, helping to prolong battery life in portable devices. In summary, OMAPL137CZKBA3 is a highly capable IC component that combines an ARM926EJ-S processor and a TMS320C6747 DSP core. With its dual-core architecture, enhanced DSP performance, connectivity options, and various peripherals, it offers a powerful and flexible platform for a wide range of applications, including industrial automation, audio processing, communication systems, and more.

In Stock: 2016

MOQ
1PCS
Packaging
256-BGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 52.8109
Total
$ 52.81

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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