LM5111-2MY/NOPB

Name: 9110RM
Brand: Macom®
SKU: 418C83-DS
Price: 3.3696 USD
Availability: InStock

5-A/3-A dual channel gate driver with active high or low output 4-V UVLO

1 : $5.9200

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Dasenic Part Number

63D4A4-DS

Manufacturer

Texas Instruments

Manufacturer Part #

LM5111-2MY/NOPB

Customer Reference

Datasheet

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Sample

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365 Days Warranty
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2006 In Stock

MOQ

1PCS

Delivery Time

Ship Within 48 Hours

Packaging

HVSSOP-8-EP-0.65mm

Quantity

Unit Price

$ 5.92

Total

$ 5.92

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.

Manufacturer	Texas Instruments
Integrated Circuits (ICs)	Gate Drivers for Power MOSFETs and IGBTs
Product Status	Active
Operating Temperature	-40°C ~ 125°C (TJ)
Mounting Type	Surface Mount
Package / Case	8-PowerTSSOP, 8-MSOP (0.118", 3.00mm Width)
Input Type	Inverting
Supplier Device Package	8-HVSSOP
Voltage - Supply	3.5V ~ 14V
Channel Type	Independent
Driven Configuration	Low-Side
Number of Drivers	2
Gate Type	N-Channel MOSFET
Logic Voltage - V I L, V I H	0.8V, 2.2V
Current - Peak Output ( Source, Sink)	3A, 5A
Rise / Fall Time ( Typ)	14ns, 12ns
Base Product Number	LM5111
Packaging	Dasenic-Reel®
Packaging	Cut Tape (CT)
Packaging	Tape & Reel (TR)

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Environmental & Export Classifications

EU RoHS Status	ROHS3 Compliant
MSL Rating	1 (Unlimited, 30°C/85%RH)
REACH Status	REACH Unaffected
US ECCN	EAR99
HTS US	8542.39.0001
China RoHS Status	Green Symbol: Green and environmentally friendly product

Description (v) Features

The LM5111 Dual Gate Driver replaces industry standard gate drivers with improved peak output current and efficiency. Each compound output driver stage includes MOS and bipolar transistors operating in parallel that together sink more than 5-A peak from capacitive loads. Combining the unique characteristics of MOS and bipolar devices reduces drive current variation with voltage and temperature. Undervoltage lockout protection is also provided. The drivers can be operated in parallel with inputs and outputs connected to double the drive current capability. This device is available in the SOIC package or the thermally enhanced MSOP-PowerPAD package.