CSD95372BQ5M

Name: CSD95372BQ5M
Brand: Texas Instruments
SKU: D1451C-DS
Price: 4.374 USD
Availability: InStock

60A Synchronous Buck NexFET™ Smart Power Stage

1 : $4.3740

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Dasenic Part Number

D1451C-DS

Manufacturer

Texas Instruments

Manufacturer Part #

CSD95372BQ5M

Customer Reference

Datasheet

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Sample

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365 Days Warranty
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7500 In Stock

MOQ

1PCS

Delivery Time

Ship Within 48 Hours

Packaging

SON-12-EP(5x6)

Quantity

Unit Price

$ 4.374

Total

$ 4.37

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.

Manufacturer	Texas Instruments
Integrated Circuits (ICs)	Full and Half-Bridge Drivers
Product Status	Active
Operating Temperature	-55°C ~ 150°C (TJ)
Features	Bootstrap Circuit, Status Flag
Application	Synchronous Buck Converters
Mounting Type	Surface Mount
Package / Case	12-PowerLFDFN
Technology	Power MOSFET
Interface	PWM
Supplier Device Package	12-LSON-CLIP (5x6)
Voltage - Supply	4.5V ~ 5.5V
Current - Output / Channel	60A
Current - Peak Output	90A
Fault Protection	Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO
Output Configuration	Half Bridge
Load Type	Inductive
Voltage - Load	4.5V ~ 16V
Series	NexFET™
Base Product Number	CSD95372
Packaging	Dasenic-Reel®
Packaging	Cut Tape (CT)
Packaging	Tape & Reel (TR)

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Environmental & Export Classifications

EU RoHS Status	ROHS3 Compliant
MSL Rating	2 (1 Year,30°C/60%RH)
REACH Status	REACH Unaffected
US ECCN	EAR99
HTS US	8542.39.0001
China RoHS Status	Green Symbol: Green and environmentally friendly product

Description (v) Features

The CSD95372BQ5M NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density Synchronous Buck converter. This product integrates the Driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.