BTM7741G

BTM7741 - INTEGRATED FULL-BRIDGE
part number has RoHS
1 : $0.0000

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Dasenic Part Number
456873-DS
Manufacturer Part #
BTM7741G

Customer Reference

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6000 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
28-SOIC (0.295", 7.50mm Width) Bulk

Quantity

Get pricing info from knowledgeable sales

ManufacturerInfineon Technologies
Integrated Circuits (ICs)Power Distribution Switches, Load Drivers
Product StatusActive
Operating Temperature-40°C ~ 150°C (TJ)
FeaturesSlew Rate Controlled, Status Flag
Mounting TypeSurface Mount
Package / Case28-SOIC (0.295", 7.50mm Width)
Input TypeNon-Inverting
Output TypeN/P-Channel
Supplier Device PackagePG-DSO-28-22
Ratio - Input: Output1:1
Voltage - Supply ( Vcc/ Vdd)Not Required
Number of Outputs1
Fault ProtectionOver Temperature, Short Circuit, UVLO
Output ConfigurationHigh Side
Rds On ( Typ)110mOhm
Voltage - Load1.8V ~ 42V
Current - Output ( Max)7A
Switch TypeGeneral Purpose
Base Product NumberBTM7741
PackagingBulk

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Environmental & Export Classifications
US ECCNEAR99
HTS US8542.39.0001
EU RoHS StatusRoHS Compliant
REACH StatusREACH is not affected
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The BTM7741G is an integrated circuit (IC) component that offers a variety of key features for different applications. Here is an overview of the BTM7741G: 1. Bluetooth Connectivity: The BTM7741G provides Bluetooth connectivity, allowing devices to wirelessly communicate with each other over short distances. It supports Bluetooth Low Energy (BLE) technology, making it suitable for applications with power constraints. 2. Low Power Consumption: This IC component is designed to minimize power consumption, making it ideal for battery-powered devices or applications where energy efficiency is crucial. It implements advanced power management techniques to optimize power usage. 3. Audio Support: The BTM7741G offers audio support, enabling the transmission and reception of high-quality audio over the Bluetooth connection. It includes audio codecs and supports multiple audio profiles, such as Advanced Audio Distribution Profile (A2DP) and Hands-Free Profile (HFP). 4. Firmware Upgradeability: The IC component allows for firmware upgrades, ensuring that it can benefit from future enhancements or bug fixes. This feature ensures that the BTM7741G remains compatible with the latest Bluetooth standards and protocols. 5. Integrated RF Transceiver: The BTM7741G incorporates a radio frequency (RF) transceiver, which is responsible for transmitting and receiving Bluetooth signals. This integration simplifies the design process, reducing the overall size and complexity of the end product

In Stock: 6000

MOQ
1PCS
Packaging
28-SOIC (0.295", 7.50mm Width) Bulk
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
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