MPC5554MZP132

IC MCU 32BIT 2MB FLASH 416PBGA
part number has RoHS
1 : $250.0200

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Dasenic Part Number
65DF22-DS
Manufacturer
Manufacturer Part #
MPC5554MZP132

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2943 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
416-BBGA Tray
Quantity
Unit Price
$ 250.02
Total
$ 250.02

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerNXP Semiconductors
Integrated Circuits (ICs)Embedded Microcontrollers
Product StatusNot For New Designs
Operating Temperature-40°C ~ 125°C (TA)
Mounting TypeSurface Mount
Package / Case416-BBGA
Supplier Device Package416-PBGA (27x27)
PeripheralsDMA, POR, PWM, WDT
Number of I/ O256
Speed132MHz
Core Processore200z6
R A M Size64K x 8
Program Memory TypeFLASH
Core Size32-Bit Single-Core
ConnectivityCANbus, EBI/EMI, SCI, SPI
Program Memory Size2MB (2M x 8)
Voltage - Supply ( Vcc/ Vdd)1.35V ~ 1.65V
Data ConvertersA/D 40x12b
Oscillator TypeExternal
SeriesMPC55xx Qorivva
Base Product NumberMPC5554
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN3A991A2
HTS US8542.31.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The MPC5554MZP132 is a high-performance integrated circuit (IC) component designed for a wide range of automotive and industrial applications. It belongs to the MPC5xxx family of microcontrollers developed by NXP Semiconductors. This IC is built on the Power Architecture® technology and offers advanced processing capabilities. Let's explore some of its key features: 1. Processing Power: The MPC5554MZP132 is powered by a 32-bit Power Architecture CPU core, offering up to 132 MHz clock speed. This processing power enables the IC to execute complex tasks efficiently. 2. Memory: It comes equipped with 3 MB of embedded Flash memory, allowing for storage of program code and data. Additionally, it includes 128 KB of data Flash memory and 96 KB of Static Random-Access Memory (SRAM) for high-speed data processing. 3. Connectivity: The IC offers various interfaces to facilitate seamless connectivity with external devices. It includes multiple FlexCAN (Controller Area Network) modules, which make it suitable for automotive applications. It also features Serial Peripheral Interface (SPI), Inter-Integrated Circuit (I2C), and Universal Asynchronous Receiver-Transmitter (UART) interfaces. 4. Enhanced Timing and Control: The MPC5554MZP132 incorporates a sophisticated eTIMER module, enabling precise timing and control functions. This module offers a broad range of features, including multiple Timer Channels, Pulse Width Modulation (PWM) outputs, and interrupt-driven timing events. 5. External Bus Interface: To cater to diverse application needs, this IC integrates an External Bus Interface (EBI). It supports various memory types, such as SRAM, flash, and programmable logic devices. This allows for easy expansion of memory resources. 6. Enhanced Security: NXP has incorporated advanced security features in the MPC5554MZP132 to protect sensitive data. It includes a Memory Management Unit (MMU) and a Memory Protection Unit (MPU), ensuring secure access to memory areas and preventing unauthorized code execution. 7. Analog Peripherals: The IC provides a range of analog peripherals, including a 10-bit Analog-to-Digital Converter (ADC) capable of acquiring precise analog measurements. It also offers Digital-to-Analog Converter (DAC) channels, allowing generation of analog signals. 8. Temperature and Voltage Management: The MPC5554MZP132 includes a Temperature Sensor Module (TSENS) that assists in monitoring the device's temperature. It is crucial for fault detection, allowing the system to take necessary measures for thermal management. Additionally, it features voltage monitoring circuits to ensure stable voltage levels. In summary, the MPC5554MZP132 is a feature-rich IC designed for demanding automotive and industrial applications. Its powerful processing capabilities, large memory capacity, versatile connectivity options, and comprehensive set of peripherals make it suitable for a wide range of embedded system designs. Additionally, the inclusion of advanced security and temperature/voltage management features further enhances its reliability and performance.

In Stock: 2943

MOQ
1PCS
Packaging
416-BBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 250.02
Total
$ 250.02

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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