MT46V64M16P-6T:A

IC DRAM 1GBIT PARALLEL 66TSOP
part number has RoHS
1 : $0.0000

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Dasenic Part Number
B67BB4-DS
Manufacturer
Manufacturer Part #
MT46V64M16P-6T:A

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70 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
66-TSSOP (0.400", 10.16mm Width)

Quantity

Get pricing info from knowledgeable sales

ManufacturerMicron Technology
Integrated Circuits (ICs)Memory
Product StatusObsolete
Operating Temperature0°C ~ 70°C (TA)
Package / Case66-TSSOP (0.400", 10.16mm Width)
TechnologySDRAM - DDR
Supplier Device Package66-TSOP
Memory Size1Gb (64M x 16)
Memory TypeVolatile
Voltage - Supply2.3V ~ 2.7V
Clock Frequency167 MHz
Access Time700 ps
Memory FormatDRAM
Memory InterfaceParallel
Write Cycle Time - Word, Page15ns

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component, MT46V64M16P-6T:A, is a high-speed synchronous dynamic random-access memory (SDRAM) device developed by Micron Technology. It is primarily designed for applications requiring high bandwidth, low power consumption, and high-speed data transfer. Key Features: 1. Density: The MT46V64M16P-6T:A offers a memory density of 1 Gigabit, organized as 64M words x 16 bits. This allows for storing a large amount of data, making it ideal for demanding applications. 2. Synchronous Interface: It features a synchronous interface, meaning that the timing and coordination of data transfers are controlled by a clock signal. This ensures seamless data synchronization and efficient operation. 3. High Speed: The device operates at a maximum clock frequency of 166 MHz, enabling fast read and write access times. The faster data transfer rate enhances the overall performance of the system. 4. Low Power Consumption: The MT46V64M16P-6T:A is designed to minimize power usage. It employs advanced power-saving features such as partial-array self-refresh (PASR) and power-down mode, reducing energy consumption during idle or low activity periods. 5. Burst Mode Operation: This IC component supports burst mode operations, allowing for consecutive memory access with reduced latency. It enables efficient data transfer and boosts system performance

In Stock: 70

MOQ
1PCS
Packaging
66-TSSOP (0.400", 10.16mm Width)
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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