M29W256GSL70ZS6F

IC FLASH 256MBIT PARALLEL 64FBGA

1 : $0.0000

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Dasenic Part Number

9EF55E-DS

Manufacturer

Micron Technology

Manufacturer Part #

M29W256GSL70ZS6F

Customer Reference

Datasheet

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45 In Stock

MOQ

1PCS

Delivery Time

Ship Within 48 Hours

Packaging

64-LBGA Tray

Quantity

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Manufacturer	Micron Technology
Integrated Circuits (ICs)	Memory
Product Status	Obsolete
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	64-LBGA
Technology	FLASH - NOR
Supplier Device Package	64-FBGA (11x13)
Memory Size	256Mbit
Memory Type	Non-Volatile
Voltage - Supply	2.7V ~ 3.6V
Access Time	70 ns
Memory Format	FLASH
Memory Interface	Parallel
Write Cycle Time - Word, Page	70ns
Base Product Number	M29W256
Memory Organization	32M x 8, 16M x 16
Packaging	Tray

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Environmental & Export Classifications

EU RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours,30°C/60%RH)
REACH Status	REACH Unaffected
US ECCN	3A991B1A
HTS US	8542.32.0071
China RoHS Status	Orange Symbol: Safe for use during the environmental protection period

Description (v) Features

The M29W256GSL70ZS6F is an IC (integrated circuit) component, specifically a flash memory module. Below is a brief overview and key features of this particular IC component: 1. Manufacturer: The M29W256GSL70ZS6F is manufactured by STMicroelectronics, a well-known semiconductor company. 2. Memory Size: This IC module has a memory size of 256 megabits (32 megabytes). 3. Memory Type: It uses flash memory technology, which means data can be stored and retained even without a power supply. 4. Organization: The memory is organized as 64 sectors of 512 kilobytes each or 128 sectors of 256 kilobytes each. This allows for flexible utilization of memory space. 5. Speed: The IC component is designed to operate at a speed grade of 70ns. This indicates the time it takes to access or retrieve data from the memory. 6. Voltage: It operates within a voltage range of 2.7V to 3.6V (VCC) with a standby supply current of less than 1uA. 7. Package Type: The M29W256GSL70ZS6F comes in a surface mount TSOP (Thin Small Outline Package) with 56 leads. 8. Memory Erase and Program: It supports full-chip erase, sector erase, and byte programming