EP3SL70F780I3N

IC FPGA 488 I/O 780FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
BCF6D8-DS
Manufacturer
Manufacturer Part #
EP3SL70F780I3N

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1890 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseFBGA-780
SeriesStratix III
Number of I/ Os488
Mounting StyleSMD/SMT
Operating Supply Voltage1.2 V to 3.3 V
PackagingTray
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
Number of Logic Blocks2700
Embedded Block R A M E B R1.8 Mbit
Distributed R A M2.1 Mbit

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The EP3SL70F780I3N is an IC (integrated circuit) component from the EP3S series of FPGAs (Field-Programmable Gate Arrays) offered by Intel. This particular IC stands out due to its notable features, which offer a range of capabilities for designers and developers. Here is a brief overview of this IC component and its key features: 1. FPGA Architecture: The EP3SL70F780I3N is based on a Stratix III FPGA architecture, which provides a high level of flexibility and configurability. The FPGA fabric consists of an array of programmable logic elements (LEs) that can be interconnected to perform complex digital logic operations. 2. Logic Capacity: This IC offers a logic capacity of up to 70,208 LEs, which allows designers to implement relatively large and sophisticated digital logic designs. The abundance of LEs enables the implementation of diverse functions, such as data processing, signal processing, and control logic. 3. High-Speed Transceivers: It features four high-speed transceiver channels, each capable of operating at data rates up to 3.75 Gbps (gigabits per second). These transceivers facilitate the transmission and reception of high-speed data, making the IC suitable for applications requiring fast communication interfaces. 4. Embedded Memory: The EP3SL70F780I3N includes 1,239 Kbits of embedded memory, providing storage for intermediate data or configuration purposes

In Stock: 1890

MOQ
1PCS
Packaging
780-BBGA, FCBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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