EP3SL200H780I4N

IC FPGA 488 I/O 780HBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
68557D-DS
Manufacturer
Manufacturer Part #
EP3SL200H780I4N

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

27 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-HBGA (33x33)
Voltage - Supply0.86V ~ 1.15V
Number of I/ O488
Number of L A Bs/ C L Bs8000
Number of Logic Elements/ Cells200000
Total R A M Bits10901504
SeriesStratix® III L
Base Product NumberEP3SL200
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for EP3SL200H780I4N.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
EP3SL200H780I4N is an integrated circuit (IC) component manufactured by Intel. It belongs to the Altera Stratix III series, which is a family of programmable logic devices (PLDs) designed for various applications. Key features of the EP3SL200H780I4N IC component include: 1. High-density Programmable Logic: The EP3SL200H780I4N offers a high-density PLD architecture, allowing for the integration of complex digital logic functions. It consists of logic elements (LEs) that can be configured to implement custom logic designs. 2. Advanced Memory Options: This IC component provides various memory options, including embedded memory blocks (RAMs) and flash memory. These memory elements can be efficiently utilized for data storage and retrieval in a wide range of applications. 3. High-Speed Interfaces: EP3SL200H780I4N supports high-speed transceiver channels, enabling reliable and fast data communication across different devices. These transceivers comply with industry-standard protocols, such as PCI Express and Gigabit Ethernet. 4. Flexible Connectivity: The IC component features a comprehensive set of I/O interfaces, supporting various communication standards like LVDS, SSTL, and HSTL. The flexibility allows easy integration with external devices, peripherals, and other components

In Stock: 27

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04