5SGXMBBR2H43C3N

IC FPGA 600 I/O 1760HBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
887C9B-DS
Manufacturer
Manufacturer Part #
5SGXMBBR2H43C3N

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52 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1760-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-HBGA (45x45)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O600
Number of L A Bs/ C L Bs359200
Number of Logic Elements/ Cells952000
Total R A M Bits53248000
SeriesStratix® V GX
Base Product Number5SGXMBB
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGXMBBR2H43C3N is a highly integrated Field Programmable Gate Array (FPGA) IC (Integrated Circuit) developed by Intel. It is a member of the Stratix V GX family and belongs to the 5th generation of Stratix FPGAs. The FPGA offers a wide range of features and capabilities, making it suitable for a variety of applications in sectors such as telecommunications, industrial automation, and high-performance computing. Here's an overview of the key features of the 5SGXMBBR2H43C3N: 1. FPGA Architecture: The device employs a unique architecture that combines programmable logic elements and embedded memory blocks, allowing for high-speed data processing and efficient implementation of complex digital systems. 2. Logic Capacity: The 5SGXMBBR2H43C3N offers a sizeable logic capacity with 43,661K logic elements (LEs). Logic elements are the building blocks of the FPGA used for implementing various digital functions. 3. Transceiver Technology: The FPGA incorporates advanced transceiver technology, providing support for high-speed serial communication interfaces like PCI Express Gen1/2/3, Gigabit Ethernet, and Serial RapidIO. This capability enables rapid data transfer and communication between different devices in the system

In Stock: 52

MOQ
1PCS
Packaging
1760-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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