5SGXMB9R1H43C2LN

IC FPGA 600 I/O 1760HBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
F8F556-DS
Manufacturer
Manufacturer Part #
5SGXMB9R1H43C2LN

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24 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1760-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-HBGA (45x45)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O600
Number of L A Bs/ C L Bs317000
Number of Logic Elements/ Cells840000
Total R A M Bits53248000
SeriesStratix® V GX
Base Product Number5SGXMB9
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGXMB9R1H43C2LN is an advanced Integrated Circuit (IC) component developed by Intel under its Stratix V GT FPGA series. It is highly regarded for its exceptional performance, flexibility, and versatility, making it suitable for a wide range of applications. This IC offers several key features that contribute to its popularity among designers and developers. Here is an overview of its main features: 1. FPGA Architecture: The 5SGXMB9R1H43C2LN is built on a 28nm manufacturing process and utilizes a Stratix V GT FPGA architecture, providing a high level of integration and performance. 2. High-Speed Connectivity: It offers advanced transceiver technology, enabling high-speed data transmission rates of up to 10 Gbps (Gigabits per second). These transceivers support various protocols, including PCI Express (PCIe) Gen1, Gen2, and Gen3, allowing for seamless interface connectivity. 3. Embedded Memory: The IC features embedded memory resources, including M20K memory blocks, which provide large amounts of on-chip memory for efficient data processing and storage. 4. Processing Power: It includes a powerful FPGA fabric that incorporates a high number of logic elements, arithmetic blocks, and DSP (Digital Signal Processing) blocks. This enables the implementation of complex algorithms and enhances computational capabilities. 5. Configuration and Security: The IC component supports various configuration modes, including passive and active configuration through dedicated flash memory

In Stock: 24

MOQ
1PCS
Packaging
1760-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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