5SGXMA9K2H40I3LN

IC FPGA 696 I/O 1517HBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
7257A5-DS
Manufacturer
Manufacturer Part #
5SGXMA9K2H40I3LN

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63 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-HBGA (45x45)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O696
Number of L A Bs/ C L Bs317000
Number of Logic Elements/ Cells840000
Total R A M Bits53248000
SeriesStratix® V GX
Base Product Number5SGXMA9
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGXMA9K2H40I3LN is a high-performance Field-Programmable Gate Array (FPGA) from Intel's Stratix V family. Here is an overview and key features of this integrated circuit (IC) component: Overview: The 5SGXMA9K2H40I3LN is designed to deliver efficient processing performance and superior flexibility, making it suitable for a wide range of applications such as high-end communication systems, data centers, military systems, medical equipment, and more. It incorporates advanced features and technologies to ensure optimal performance and ease of use. Key Features: 1. FPGA Architecture: The 5SGXMA9K2H40I3LN features a Stratix V FPGA architecture based on Intel's 28nm process technology. This enables it to provide high logic density, allowing designers to implement complex designs with significant processing power. 2. High-Speed Connectivity: It supports a variety of high-speed communication interfaces, including Transceiver-based protocols such as PCIe Gen3 x8, XAUI, and Gigabit Ethernet. This makes it suitable for applications requiring fast data transfer and real-time processing. 3. High Logic Capacity: With a generous amount of configurable logic elements (LEs) and adaptive logic modules (ALMs), this FPGA offers the flexibility to accommodate complex designs. It also includes embedded memory blocks to store large amounts of data efficiently

In Stock: 63

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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