5SGXEA7K3F35I3N

IC FPGA 432 I/O 1152FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
E2F621-DS
Manufacturer
Manufacturer Part #
5SGXEA7K3F35I3N

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

2437 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseFBGA-1152
SeriesStratix V GX
Number of I/ Os432
Mounting StyleSMD/SMT
PackagingTray
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
Number of Logic Blocks2560
Distributed R A M50 Mbit

Kindly contact our sales Rep to obtain the data you desire for 5SGXEA7K3F35I3N.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The 5SGXEA7K3F35I3N is a powerful Integrated Circuit (IC) component developed by Intel under their Stratix V FPGA (Field-Programmable Gate Array) family. This FPGA offers advanced features and capabilities, making it suitable for a wide range of applications requiring high-performance computing, networking, and processing. Key features of the 5SGXEA7K3F35I3N IC component include: 1. FPGA Architecture: The 5SGXEA7K3F35I3N utilizes a 28nm FPGA architecture, providing a high level of integration, performance, and efficiency. 2. Logic Elements and Memory: It offers 369,280 logic elements (LEs) that can be programmed to implement complex digital circuits and algorithms. Additionally, it provides 28,672 Kbits of embedded memory (RAM), allowing for efficient data storage and processing within the FPGA. 3. DSP Blocks: The IC includes 2,530 digital signal processing (DSP) blocks, making it capable of executing high-speed and complex digital signal processing algorithms. 4. Transceivers: It is equipped with 24 transceiver channels capable of achieving speeds up to 12.5 Gbps. These transceivers enable high-speed data transfer and communication between FPGAs or external devices. 5. High-Speed Interfaces: The IC component supports various high-speed interfaces, including PCIe (PCI Express), Ethernet, USB, and others

In Stock: 2437

MOQ
1PCS
Packaging
1152-BBGA, FCBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04