5ASXFB3G4F35I3N

IC SOC CORTEX-A9 1.05GHZ 1152BGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
D3EF03-DS
Manufacturer
Manufacturer Part #
5ASXFB3G4F35I3N

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79 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA, FC (35x35)
PeripheralsDMA, POR, WDT
ArchitectureMCU, FPGA
Number of I/ OMCU - 208, FPGA - 385
Speed1.05GHz
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
R A M Size64KB
ConnectivityEBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesFPGA - 350K Logic Elements
SeriesArria V SX
Base Product Number5ASXFB3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A7A
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component 5ASXFB3G4F35I3N is a high-performance field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). Below is an overview of its key features: 1. FPGA Architecture: The 5ASXFB3G4F35I3N is based on the Arria V series FPGA architecture. It offers a balance between performance, power efficiency, and system integration. 2. Logic Capacity: This FPGA provides a generous logic capacity to accommodate complex digital designs. It features 346,080 logic elements (LEs), which are programmable building blocks for implementing digital circuits. 3. High-Speed Connectivity: The 5ASXFB3G4F35I3N supports various high-speed serial interfaces, including Gigabit Ethernet (GbE), PCIe, and SATA, enabling seamless integration with external devices. 4. Memory Capacity: It incorporates up to 8.6 Mb of embedded memory, making it suitable for applications requiring significant on-chip storage. The memory can be flexibly partitioned according to design requirements. 5. DSP Blocks: The FPGA includes 744 digital signal processing (DSP) blocks that are optimized for mathematical and signal processing operations. These blocks provide efficient hardware implementation of functions like filtering, multiplication, and addition. 6. Low Power Consumption: The 5ASXFB3G4F35I3N is designed to be power-efficient, utilizing a combination of low-power transistors and advanced power management techniques. It enables energy-saving without compromising on performance. 7. Configuration Options: The FPGA can be configured using various methods, such as passive serial (PS) or active serial (AS) configuration schemes. It also supports remote system upgrades via JTAG and partial reconfiguration capabilities. 8. Robust Transceiver Support: This FPGA includes up to 12 high-speed transceivers, which provide reliable serial data communication at speeds up to 10.3125 Gbps. These transceivers are ideal for applications requiring substantial data throughput. 9. Security Features: The 5ASXFB3G4F35I3N offers built-in security features to protect sensitive designs and intellectual property. It incorporates advanced encryption algorithms, bitstream protection, and secure boot options. 10. Development Tools: Intel provides a comprehensive suite of development tools, including Quartus Prime software, to aid designers in implementing, debugging, and optimizing FPGA designs for the 5ASXFB3G4F35I3N. These key features highlight some of the capabilities offered by the 5ASXFB3G4F35I3N FPGA, making it suitable for a wide range of applications like telecommunications, industrial control, video processing, and more.

In Stock: 79

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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