5ASTFD3G3F35I5N

IC SOC CORTEX-A9 800MHZ 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
33EB23-DS
Manufacturer
Manufacturer Part #
5ASTFD3G3F35I5N

Customer Reference

Datasheet
Sample
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58 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA, FC (35x35)
PeripheralsDMA, POR, WDT
ArchitectureMCU, FPGA
Number of I/ OMCU - 208, FPGA - 385
Speed800MHz
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
R A M Size64KB
ConnectivityEBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesFPGA - 350K Logic Elements
SeriesArria V ST
Base Product Number5ASTFD3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A7A
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component 5ASTFD3G3F35I5N is a high-performance electronic component that offers various features beneficial for advanced applications. Here is a brief overview of this component along with its key features: 1. Versatile Functionality: The 5ASTFD3G3F35I5N is designed to perform multiple functions, making it suitable for a wide range of applications such as consumer electronics, telecommunications, automotive, and industrial equipment. 2. High Speed and Performance: This component is built to provide exceptional speed and performance, ensuring efficient operation even in demanding situations. It can handle complex tasks and data-intensive processes with ease. 3. Low Power Consumption: With a focus on energy efficiency, the 5ASTFD3G3F35I5N minimizes power consumption, making it suitable for battery-powered devices that require extended usage time. 4. Advanced Connectivity: This IC component offers advanced connectivity options, enabling seamless integration with various communication protocols. It supports high-speed data transfer and reliable communication between devices. 5. Enhanced Security: Security features are integrated into the 5ASTFD3G3F35I5N to safeguard sensitive data and protect against unauthorized access. These features ensure the integrity and confidentiality of information in critical applications. 6. Compact Form Factor: The 5ASTFD3G3F35I5N is designed to occupy minimal space, making it suitable for compact devices or applications where size constraints exist. Its compact form factor allows for easy integration into existing systems. 7. Robust Design: This component is built with durability in mind, with robust materials and design techniques used during manufacturing. It can withstand harsh environmental conditions, including temperature variations and mechanical stress. 8. Reliable Performance: The 5ASTFD3G3F35I5N undergoes rigorous testing and quality control measures to ensure reliable and stable performance over extended periods. It is designed to minimize errors and system failures. 9. Broad Temperature Range: This IC component operates reliably across a wide temperature range, making it suitable for applications that require operation in extreme temperature environments. 10. Scalability: The 5ASTFD3G3F35I5N component is highly scalable, allowing for flexible integration into various system architectures. It can be combined with other components or modules to create complex systems tailored to specific requirements. Overall, the 5ASTFD3G3F35I5N is a versatile and high-performance IC component that offers numerous features for demanding applications.

In Stock: 58

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
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