XCZU19EG-2FFVB1517I

IC SOC CORTEX-A53 1517FCBGA
part number has RoHS
1 : $16905.6600

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Dasenic Part Number
B98CF9-DS
Manufacturer
Manufacturer Part #
XCZU19EG-2FFVB1517I

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1501 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FCBGA (40x40)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O644
Speed533MHz, 600MHz, 1.3GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 1143K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU19
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU19EG-2FFVB1517I is an integrated circuit (IC) component developed by Xilinx. It belongs to the Zynq UltraScale+ RFSoC (Radio Frequency System on Chip) series and offers advanced features for various applications in the field of wireless communications, aerospace, defense, and more. Let's delve into the key features and capabilities of this powerful IC component. 1. SoC Architecture: The XCZU19EG-2FFVB1517I is built upon the system-on-chip (SoC) architecture, combining high-performance processing with FPGA programmability. It integrates a quad-core ARM Cortex-A53 processor and dual-core Cortex-R5 real-time processor, allowing for flexible and efficient task execution. 2. FPGA Fabric: One of the significant advantages of this IC component is its programmable FPGA fabric, enabling the hardware to be customized based on specific application requirements. It contains a massive number of programmable logic cells, allowing designers to implement complex digital circuits, accelerators, or custom interfaces. 3. UltraScale+ Architecture: The UltraScale+ architecture employed in the XCZU19EG-2FFVB1517I offers enhanced performance and power efficiency compared to its predecessors. It incorporates advanced technologies like 16nm FinFET+ process technology, which contributes to improved speed, power consumption, and overall system performance. 4. RF Data Conversion: The XCZU19EG-2FFVB1517I supports simultaneous analog and digital data processing with its integrated RF-ADC (Analog-to-Digital Converter) and RF-DAC (Digital-to-Analog Converter) blocks. These blocks enable the direct conversion of RF signals, eliminating the need for external components and minimizing system complexity. 5. Wideband Connectivity: With 16 integrated analog-to-digital converter channels and 16 digital-to-analog converter channels, this IC component provides extensive connectivity options for high-speed data transfer. Additionally, it offers various communication interfaces such as PCIe, USB, Ethernet, DDR4 memory controllers, and configurable I/Os. 6. Signal Processing Capabilities: The XCZU19EG-2FFVB1517I excels in signal processing tasks, thanks to its ample processing resources. It features floating-point units, vector processors, and numerous DSP slices, allowing for efficient implementation of algorithms like digital filtering, modulation/demodulation, beamforming, and more. 7. Security and System Integrity: Xilinx prioritizes security features in their IC components, including the XCZU19EG-2FFVB1517I. It offers multiple layers of protection, such as secure boot, encrypted bitstream delivery, and configuration lockdown, preserving the system integrity and preventing unauthorized access to critical resources. 8. Software Development Environment: Xilinx provides a robust software development environment with dedicated tools, libraries, and frameworks to facilitate the design, verification, and programming of the XCZU19EG-2FFVB1517I. This allows developers to harness its full potential while streamlining the development process. In conclusion, the XCZU19EG-2FFVB1517I is a versatile IC component from Xilinx's Zynq UltraScale+ RFSoC family. Its SoC architecture, FPGA fabric, RF data conversion capabilities, wideband connectivity, signal processing prowess, security features, and comprehensive software development environment make it an ideal choice for numerous applications demanding high-performance and flexibility in wireless communications, aerospace, defense, and more.

In Stock: 1501

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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