XCV1000E-7BG560C

IC FPGA 404 I/O 560MBGA
part number has RoHS
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Dasenic Part Number
461523-DS
Manufacturer
Manufacturer Part #
XCV1000E-7BG560C

Customer Reference

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75 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
560-LBGA Exposed Pad, Metal

Quantity

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ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case560-LBGA Exposed Pad, Metal
Supplier Device Package560-MBGA (42.5x42.5)
Voltage - Supply1.71V ~ 1.89V
Number of Gates1569178
Number of I/ O404
Number of L A Bs/ C L Bs6144
Number of Logic Elements/ Cells27648
Total R A M Bits393216
SeriesVirtex®-E
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XCV1000E-7BG560C is a high-performance field-programmable gate array (FPGA) IC component manufactured by Xilinx. It offers a wide range of features and capabilities suitable for various applications. Let's explore its key features in detail: 1. Programmable Logic Cells: The XCV1000E-7BG560C FPGA contains 1,020,000 system gates and 68,544 logic cells, which enable the implementation of complex digital circuits. These logic cells can be configured to provide a wide range of functionalities. 2. Configurable I/O Pins: This component offers 464 general-purpose I/O pins, allowing for flexible interfacing with external devices. These pins can be customized to support different voltage standards, including LVCMOS, LVTTL, and HSTL, among others. 3. Versatile Memory Resources: The FPGA consists of 16,896 bytes of Block RAM, which can be used for data storage or as multipliers or FIFO buffers. Additionally, it provides 96 bits of synchronous dual-port RAM and up to 256K bits of distributed RAM. These memory resources contribute to efficient data processing and storage. 4. Advanced Digital Signal Processing (DSP) Capabilities: The XCV1000E-7BG560C offers 16x18-bit multipliers for high-performance DSP applications

In Stock: 75

MOQ
1PCS
Packaging
560-LBGA Exposed Pad, Metal
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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