XC7K70T-1FBG676I

IC FPGA 300 I/O 676FCBGA
part number has RoHS
1 : $258.5430

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Dasenic Part Number
8B6DC6-DS
Manufacturer
Manufacturer Part #
XC7K70T-1FBG676I

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1665 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
676-BBGA, FCBGA
Quantity
Unit Price
$ 258.543
Total
$ 258.54

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Operating Temperature-40??C ~ 100??C (TJ)
Mounting TypeSurface Mount
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/ O300
Number of L A Bs/ C L Bs5125
Number of Logic Elements/ Cells65600
Total R A M Bits4976640
Voltage Supply0.97V ~ 1.03V

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XC7K70T-1FBG676I is a high-performance, low-power field-programmable gate array (FPGA) integrated circuit (IC) produced by Xilinx. This IC belongs to the Xilinx Kintex-7 family of FPGAs and offers versatile features for various applications ranging from communications and networking to signal processing and embedded systems. Some of the key features and specifications of the XC7K70T-1FBG676I include: 1. FPGA Architecture: The IC is built on a 28nm process technology utilizing a sophisticated programmable logic fabric that consists of configurable logic blocks (CLBs), Block RAMs, Digital Signal Processing (DSP) slices, clock management resources, and I/O ports. 2. Logic Capacity: The XC7K70T-1FBG676I offers a generous amount of logic capacity, with 68,200 slices (each slice comprises four 6-input LUTs and eight flip-flops) available for implementing complex digital designs. 3. DSP Resources: To support high-performance signal processing applications, this IC incorporates 740 DSP slices. Each DSP slice features an 18x18 multiplier, pre-adder, and an accumulator, enabling efficient implementation of arithmetic-intensive algorithms. 4. Memory Resources: The XC7K70T-1FBG676I includes embedded memory resources such as Block RAMs (BRAM) and UltraRAM, offering a total of 4

In Stock: 1665

MOQ
1PCS
Packaging
676-BBGA, FCBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 258.543
Total
$ 258.54

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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