XC3S1000-5FGG320C

IC FPGA 221 I/O 320FBGA
part number has RoHS
1 : $283.4000

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Dasenic Part Number
9649F4-DS
Manufacturer
Manufacturer Part #
XC3S1000-5FGG320C

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2556 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
320-BGA
Quantity
Unit Price
$ 283.4
Total
$ 283.4

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusActive
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case320-BGA
Supplier Device Package320-FBGA (19x19)
Voltage - Supply1.14V ~ 1.26V
Number of Gates1000000
Number of I/ O221
Number of L A Bs/ C L Bs1920
Number of Logic Elements/ Cells17280
Total R A M Bits442368
SeriesSpartan®-3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusREACH is not affected
US ECCNEAR99
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XC3S1000-5FGG320C is an IC (integrated circuit) component developed by Xilinx. Below is a summary of its key features: 1. FPGA (Field-Programmable Gate Array): The XC3S1000-5FGG320C is an FPGA chip designed for programmable logic applications. FPGAs provide the flexibility of reconfigurability, allowing users to implement custom digital circuits. 2. Spartan-3 Family: It belongs to Xilinx's Spartan-3 FPGA family, which offers a balance between cost-effectiveness and performance. This family of FPGAs is targeted towards applications requiring medium-level digital processing capabilities. 3. Logic Capacity: The "1000" in the component's name signifies its logic capacity, indicating that it has approximately 1,000,000 (1 million) system gates. This gives designers enough resources to implement various complex digital circuits. 4. Speed Grade: The "5" in the component's name refers to its speed grade. It indicates that the XC3S1000-5FGG320C operates at a maximum frequency of 5 nanoseconds (200 MHz). This ensures fast and efficient operation of the implemented circuits. 5. Package Type: The component uses a 320-ball Fine-Pitch Ball Grid Array (FBGA) package. The FBGA package ensures reliable electrical connections while minimizing the overall footprint of the chip

In Stock: 2556

MOQ
1PCS
Packaging
320-BGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 283.4
Total
$ 283.4

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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