MPC860ENCZQ66D4

IC MPU MPC8XX 66MHZ 357BGA
part number has RoHS
1 : $177.9120

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Dasenic Part Number
04D96F-DS
Manufacturer
Manufacturer Part #
MPC860ENCZQ66D4

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1908 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
357-BBGA Tray
Quantity
Unit Price
$ 177.912
Total
$ 177.91

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerNXP Semiconductors
Integrated Circuits (ICs)Embedded Microprocessors
Product StatusObsolete
Operating Temperature-40°C ~ 95°C (TA)
Mounting TypeSurface Mount
Package / Case357-BBGA
Supplier Device Package357-PBGA (25x25)
Voltage - I/ O3.3V
Speed66MHz
Core ProcessorMPC8xx
Number of Cores/ Bus Width1 Core, 32-Bit
Co- Processors/ D S PCommunications; CPM
R A M ControllersDRAM
Graphics AccelerationNo
Ethernet10Mbps (4)
SeriesMPC8xx
Base Product NumberMPC86
Additional InterfacesI²C, IrDA, PCMCIA, SPI, TDM, UART/USART
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN5A991B4B
HTS US8542.31.0001
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The MPC860ENCZQ66D4 is an Integrated Circuit (IC) component that belongs to the PowerQUICC family of microprocessors, manufactured by NXP Semiconductors. This IC is widely used in networking, telecommunications, and industrial applications due to its robust performance and rich feature set. Here is an overview of the MPC860ENCZQ66D4 along with its key features: 1. Architecture: The MPC860ENCZQ66D4 is based on a modified Harvard architecture with a RISC (Reduced Instruction Set Computing) design. It incorporates a Power Architecture core that operates at a clock speed of up to 66 MHz. 2. Processor Cores: This IC features a single enhanced PowerPC CPU core, which delivers high performance and efficiency. The CPU incorporates a three-stage pipeline and an on-chip memory management unit for efficient execution of instructions. 3. Communication Interfaces: The MPC860ENCZQ66D4 offers various communication interfaces, making it ideal for networking applications. It includes two 10/100 Mbps Ethernet controllers with Media Independent Interfaces (MII) for connecting to Ethernet networks. Additionally, it has two serial controllers supporting asynchronous/synchronous serial communication protocols. 4. Integrated Memory: This IC includes a versatile memory system, which simplifies the design of the overall system. It integrates a 16 KB instruction cache and an 8 KB data cache for faster access to frequently used instructions and data. It also supports external memory expansion with interfaces like SDRAM, SRAM, and Flash. 5. Advanced Interrupt Controller: It features an advanced interrupt controller that efficiently manages and prioritizes interrupts from various sources. This ensures reliable handling of real-time events and improves system responsiveness. 6. Timers and PWM Channels: MPC860ENCZQ66D4 includes a range of timers and Pulse Width Modulation (PWM) channels. It comprises four general-purpose timers and two dual-channel 16-bit PWMs, facilitating precise timing and control operations in industrial applications. 7. System Integration: The IC includes versatile system integration features. It offers an Integrated System Bus (ISB) for connecting to other system components and peripherals. It also includes a Parallel Interface Controller (PIC) for interfacing with external devices like LCD displays. 8. Low Power Consumption: The MPC860ENCZQ66D4 is designed to optimize power consumption. It incorporates various power-saving techniques, such as multiple clock gating modes and power management units. This makes it suitable for battery-operated applications and energy-efficient systems. In conclusion, the MPC860ENCZQ66D4 is a versatile and high-performance IC component with a set of key features that make it popular in networking, telecommunications, and industrial applications. With its robust architecture, advanced communication interfaces, integrated memory, and optimized power consumption, it provides a reliable and efficient solution for various embedded system requirements.

In Stock: 1908

MOQ
1PCS
Packaging
357-BBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 177.912
Total
$ 177.91

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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