XPC8255CVVIFBC

IC MPU MPC82XX 200MHZ 480TBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
81B276-DS
Manufacturer
Manufacturer Part #
XPC8255CVVIFBC

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81 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
480-LBGA Exposed Pad Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerNXP Semiconductors
Integrated Circuits (ICs)Embedded Microprocessors
Product StatusObsolete
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case480-LBGA Exposed Pad
Supplier Device Package480-TBGA (37.5x37.5)
Voltage - I/ O3.3V
Speed200MHz
Core ProcessorPowerPC G2
Number of Cores/ Bus Width1 Core, 32-Bit
Co- Processors/ D S PCommunications; RISC CPM
R A M ControllersDRAM, SDRAM
Graphics AccelerationNo
Ethernet10/100Mbps (3)
SeriesMPC82xx
Base Product NumberXPC82
Additional InterfacesI²C, SCC, SMC, SPI, UART, USART
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN5A991B4B
HTS US8542.31.0001
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XPC8255CVVIFBC is an IC component manufactured by Xilinx. It is a versatile, high-performance programmable system-on-chip (SoC) that integrates various features to enable efficient embedded system development. Here's an overview of the key features of the XPC8255CVVIFBC: 1. Processor: The XPC8255CVVIFBC incorporates a PowerPC 405 core, offering a rich instruction set architecture with 32-bit processing capabilities. This processor operates at a maximum frequency of 450 MHz, providing substantial computational power for various applications. 2. Programmable Logic: This IC component combines a configurable logic block (CLB) with programmable interconnect resources. It integrates Xilinx's advanced Field Programmable Gate Array (FPGA) technology, allowing users to design custom logic functions and tailor the IC according to their specific needs. 3. Memory: To facilitate efficient data storage, the XPC8255CVVIFBC features a variety of memory options. It includes on-chip memory components like local memory and distributed RAM, which provide low-latency access for critical data. Additionally, the IC supports external memory interfaces, enabling connection to DDR SDRAM or other memory modules. 4. Connectivity: To enable seamless communication, the XPC8255CVVIFBC incorporates various connectivity interfaces. It offers multiple UART (Universal Asynchronous Receiver/Transmitter) ports, I2C (Inter-Integrated Circuit) interfaces, and GPIO (General Purpose Input/Output) pins. Moreover, it includes Ethernet MAC (Media Access Control) with integrated Physical Layer (PHY), allowing network connectivity. 5. Peripheral Interfaces: This IC component offers a range of peripheral interfaces to enable interaction with external devices. It includes standard interfaces like SPI (Serial Peripheral Interface), CAN (Controller Area Network), and USB (Universal Serial Bus), enabling easy integration with various communication protocols. 6. Embedded Software Development: Xilinx provides an extensive set of development tools and libraries to facilitate software development for the XPC8255CVVIFBC. This includes software development kits (SDKs) with compilers, debuggers, and integrated development environments (IDEs). These tools support both low-level bare-metal programming and higher-level operating systems like Linux. 7. Security Features: The XPC8255CVVIFBC incorporates various security features to protect sensitive data and ensure system integrity. It includes hardware-accelerated encryption/decryption engines, secure boot capabilities, and tamper-resistant mechanisms. These features strengthen the IC's ability to handle secure applications. In summary, the XPC8255CVVIFBC is an advanced programmable SoC offering a powerful processor, extensive memory options, versatile connectivity interfaces, and robust security features. This IC component empowers developers to create efficient, customized solutions for a wide range of embedded applications.

In Stock: 81

MOQ
1PCS
Packaging
480-LBGA Exposed Pad Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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