The MPC8313ECZQAFFB is an integrated circuit (IC) component developed by NXP Semiconductors. It belongs to the MPC8313E series, which are highly integrated PowerQUICC II Pro processors. These processors are designed for networking and telecommunications applications, offering a wide range of features and capabilities.
The MPC8313ECZQAFFB is a central processing unit (CPU) that combines Power Architecture technology with multiple integrated peripherals and interfaces. Its key features include:
1. Power Architecture Core: The IC is powered by a Power Architecture e300 core, a high-performance 32-bit RISC processor. It operates at a clock frequency of up to 400 MHz, ensuring efficient processing and execution of tasks.
2. Integrated Peripherals: The MPC8313ECZQAFFB incorporates various peripherals within the IC, eliminating the need for additional components. It includes an Ethernet controller, supporting 10/100/1000 Mbps speeds. Additionally, it features a USB controller, offering connectivity options for various USB devices.
3. Memory Interfaces: The IC supports various types of memory interfaces to facilitate data storage and retrieval. It includes a Double Data Rate (DDR) SDRAM memory controller, which enables high-speed access to external memory. It also includes a flash memory controller, allowing for non-volatile storage.
4. Communication Interfaces: The IC offers multiple communication interfaces, making it suitable for networking applications. It includes a Serial Peripheral Interface (SPI) for connecting peripheral devices and a General-Purpose Input/Output (GPIO) interface for general-purpose I/O operations. Moreover, it includes universal asynchronous receiver/transmitter (UART) interfaces for serial communication.
5. Security Features: The MPC8313ECZQAFFB incorporates a range of security features to protect sensitive data and ensure secure communication. It includes an encryption/decryption engine for cryptographic operations, enhancing data security in communication systems.
6. Power Management: The IC features an integrated power management unit, allowing for efficient power usage and extended battery life in portable applications. It supports various power-saving modes, such as clock gating and power-down modes, to minimize power consumption.
7. Package and Temperature Range: The MPC8313ECZQAFFB is available in a 516-PBGA (Plastic Ball Grid Array) package. It is designed to operate within a temperature range of -40