The PIC18LF26K22-E/SO is a Embedded - MicrocontrollersIC designed and manufactured by Microchip Technology, as a part of their PIC® XLP™ 18K series products.
The PIC18LF26K22-E/SO features an SOIC package type—Similar to DIP but with smaller dimensions.
The component is currently in production and suitable for new designs.
The PIC18LF26K22-E/SO is ROHS3 Compliant,classified as 3A991A2, and ready for global markets.