LFSCM3GA25EP1-6FN900I

IC FPGA 378 I/O 900FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
6B8BA6-DS
Manufacturer Part #
LFSCM3GA25EP1-6FN900I

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

72 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
900-BBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerLattice Semiconductor
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 105°C (TJ)
Mounting TypeSurface Mount
Package / Case900-BBGA
Supplier Device Package900-FPBGA (31x31)
Voltage - Supply0.95V ~ 1.26V
Number of I/ O378
Number of L A Bs/ C L Bs6250
Number of Logic Elements/ Cells25000
Total R A M Bits1966080
SeriesSCM
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for LFSCM3GA25EP1-6FN900I.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component LFSCM3GA25EP1-6FN900I is a low-power, small form factor programmable logic device (PLD) manufactured by Lattice Semiconductor. It is built using the ultra-low power ECP3 FPGA family, offering high performance and flexibility for a wide range of applications. Here are some key features of the LFSCM3GA25EP1-6FN900I: 1. FPGA Architecture: The LFSCM3GA25EP1-6FN900I is based on the Lattice ECP3 FPGA architecture, which offers a balance between low power consumption and high performance. It provides a reliable and efficient solution for various embedded system designs. 2. Logic Capacity: This IC component has a logic capacity of 25,000 Look-Up Tables (LUTs), which allows for the implementation of complex digital logic circuits. It also comes with 900 built-in digital signal processing (DSP) blocks, enabling efficient processing of signal-based applications. 3. High-Speed Interfaces: The LFSCM3GA25EP1-6FN900I supports various high-speed interfaces, including Gigabit Ethernet, PCIe (PCI Express), and USB 2.0. These interfaces enable seamless integration with other devices and peripherals, facilitating communication and data transfer

In Stock: 72

MOQ
1PCS
Packaging
900-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04