LCMXO1200E-3BN256C

IC FPGA 211 I/O 256CABGA
part number has RoHS
1 : $66.1200

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Dasenic Part Number
37CB6F-DS
Manufacturer Part #
LCMXO1200E-3BN256C

Customer Reference

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2801 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
256-LFBGA, CSPBGA
Quantity
Unit Price
$ 66.12
Total
$ 66.12

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerLattice Semiconductor
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseCABGA
Memory TypeSRAM
Number of Macrocells600
Delay Time5.1 ns
Supply Current18 mA
Mounting StyleSMD/SMT
Operating Supply Voltage1.2 V
PackagingTray
Factory Pack Quantity595
Minimum Operating Temperature0 C
Maximum Operating Temperature+ 85 C
Number of Programmable I/ Os211
Supply Voltage Max1.26 V
Supply Voltage Min1.14 V

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The LCMXO1200E-3BN256C is an IC (integrated circuit) component developed by Lattice Semiconductor Corporation. It is a high-performance FPGA (Field-Programmable Gate Array) with various features that make it suitable for a wide range of applications. Here is an overview of the key features of the LCMXO1200E-3BN256C: 1. FPGA Architecture: The LCMXO1200E-3BN256C features a 20nm low-power CMOS process technology, which allows for enhanced performance and reduced power consumption. It offers 1280 Look-Up Tables (LUTs) and 64 I/O pins, making it suitable for medium-scale applications. 2. Programmability: As an FPGA, the LCMXO1200E-3BN256C is highly programmable and reconfigurable. Its programmability allows designers to implement custom logic functions and algorithms, tailored to their specific application requirements. This flexibility is a significant advantage compared to fixed-function integrated circuits. 3. Small Form Factor: The LCMXO1200E-3BN256C is available in a compact 256-ball BGA (Ball Grid Array) package. This small form factor makes it ideal for space-constrained applications where the PCB (Printed Circuit Board) real estate is limited

In Stock: 2801

MOQ
1PCS
Packaging
256-LFBGA, CSPBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 66.12
Total
$ 66.12

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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