EP3SL70F780C4NAB

IC FPGA 488 I/O 780FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
571BD6-DS
Manufacturer
Manufacturer Part #
EP3SL70F780C4NAB

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26 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-FBGA (29x29)
Voltage - Supply0.86V ~ 1.15V
Number of I/ O488
Number of L A Bs/ C L Bs2700
Number of Logic Elements/ Cells67500
Total R A M Bits2699264
SeriesStratix® III L
PackagingTray

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Environmental & Export Classifications
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCNOBSOLETE
HTS US0000.00.0000
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP3SL70F780C4NAB is an integrated circuit (IC) component developed by Intel. It belongs to the family of Stratix III FPGAs (Field-Programmable Gate Array), which are versatile devices used for implementing digital circuits. Key features of the EP3SL70F780C4NAB include: 1. FPGA Architecture: The EP3SL70F780C4NAB is built on the advanced Stratix III architecture, offering a high-performance and low-power solution for various applications. It provides programmable logic blocks, embedded memory, digital signal processing (DSP) blocks, and I/O resources. 2. Logic Capacity: This IC component has a logic capacity of approximately 70,000 adaptive logic modules (ALMs). ALMs are basic building blocks of the FPGA that can be interconnected to create complex logic functions. 3. Embedded Memory: The EP3SL70F780C4NAB includes embedded memory blocks for storing data within the device. It offers approximately 1.5 megabits of RAM (Random Access Memory) capacity, which can be used for storing configuration data or temporary data during operation. 4. High-Speed Interfaces: The IC component supports various high-speed interfaces, including Gigabit Ethernet, PCI Express, Serial RapidIO, and DDR2/DDR3 memory interfaces. These interfaces enable seamless communication with external devices and systems

In Stock: 26

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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