EP3SL200F1517I3N

IC FPGA 976 I/O 1517FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
8F6840-DS
Manufacturer
Manufacturer Part #
EP3SL200F1517I3N

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78 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FBGA (40x40)
Voltage - Supply0.86V ~ 1.15V
Number of I/ O976
Number of L A Bs/ C L Bs8000
Number of Logic Elements/ Cells200000
Total R A M Bits10901504
SeriesStratix® III L
Base Product NumberEP3SL200
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP3SL200F1517I3N is a programmable IC component manufactured by Intel, specifically designed for high-performance and low-power applications. Here's a concise overview and key features: 1. FPGA Technology: The EP3SL200F1517I3N is a field-programmable gate array (FPGA), which means it can be configured and reconfigured by a user post-manufacturing. This flexibility allows for custom logic development, making it suitable for a wide range of applications. 2. Stratix III Architecture: This component belongs to the Stratix III family of FPGAs. It incorporates a highly advanced architecture, delivering impressive performance capabilities with low power consumption. 3. Logic Capacity: The EP3SL200F1517I3N offers a logic capacity of up to 200,000 equivalent look-up tables (LUTs). This generous capacity enables the implementation of complex digital circuits and sophisticated algorithms. 4. High-Speed Interfaces: The FPGA supports a variety of high-speed interfaces, including PCIe (PCI Express), Gigabit Ethernet, USB 2.0, and Serial ATA. These interfaces facilitate seamless communication with external devices and subsystems, contributing to the overall utility of the component. 5. High-Speed Transceivers: It is equipped with built-in high-speed transceivers allowing for data transmission at rates of up to 3.125 Gbps

In Stock: 78

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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