EP3SL200F1517C4L

IC FPGA 976 I/O 1517FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
291E4B-DS
Manufacturer
Manufacturer Part #
EP3SL200F1517C4L

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

35 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FBGA (40x40)
Voltage - Supply0.86V ~ 1.15V
Number of I/ O976
Number of L A Bs/ C L Bs8000
Number of Logic Elements/ Cells200000
Total R A M Bits10901504
SeriesStratix® III L
Base Product NumberEP3SL200
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for EP3SL200F1517C4L.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP3SL200F1517C4L is an FPGA (Field-Programmable Gate Array) device. It is a member of the Stratix III family of IC components, manufactured by Intel Corporation. Here are some key features and an overview of the EP3SL200F1517C4L: 1. FPGA Technology: This IC component features an FPGA, which is a programmable logic device that allows users to configure the digital circuits according to their requirements. FPGAs provide flexibility and are widely used in various applications requiring reconfigurable hardware. 2. Stratix III Architecture: The EP3SL200F1517C4L is based on Intel's Stratix III architecture. This architecture offers high-density programmable logic with fine-grained elements, embedded memory, multipliers, and high-speed transceivers, enabling the implementation of complex digital designs. 3. Logic Density: This component offers a logic density of up to 200,000 (approximately). It provides a generous amount of resources for implementing digital circuits, such as look-up tables (LUTs), registers, and embedded memory blocks (RAM). 4. High-Speed Transceivers: The EP3SL200F1517C4L incorporates high-speed transceivers, which enable fast communication between the FPGA and external devices

In Stock: 35

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04