EP3SE80F780C3N

IC FPGA 488 I/O 780FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
E81F1B-DS
Manufacturer
Manufacturer Part #
EP3SE80F780C3N

Customer Reference

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44 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-FBGA (29x29)
Voltage - Supply0.86V ~ 1.15V
Number of I/ O488
Number of L A Bs/ C L Bs3200
Number of Logic Elements/ Cells80000
Total R A M Bits6843392
SeriesStratix® III E
Base Product NumberEP3SE80
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A7A
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP3SE80F780C3N is an Integrated Circuit (IC) component manufactured by Altera. It is a member of the Cyclone III FPGA series and offers a range of advanced features. Here are some key features of the EP3SE80F780C3N: 1. FPGA Technology: The EP3SE80F780C3N is based on Field-Programmable Gate Array (FPGA) technology, allowing users to program and reconfigure the chip according to their specific application needs. 2. Logic Elements: This IC component features up to 79,040 logic elements, which are basic building blocks that can be used to implement various digital functions. 3. Memory Blocks: It includes up to 4,608 embedded memory blocks, which can be used as either RAM (Random Access Memory) or ROM (Read-Only Memory) for storing data or programs. 4. Multiplier Blocks: The EP3SE80F780C3N contains up to 288 embedded 18x18 multiplier blocks, which are specialized hardware units used for efficient multiplication operations. 5. Clocking: It provides up to nine-phase-locked loops (PLLs) that enable precise clock generation and distribution within the FPGA, ensuring proper synchronization between different parts of the circuit. 6. High-Speed Interfaces: The IC component supports several high-speed communication interfaces, including up to 24 differential I/O channels capable of operating at speeds up to 3

In Stock: 44

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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