EP3SE260F1517I4N

IC FPGA 976 I/O 1517FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
26CC6B-DS
Manufacturer
Manufacturer Part #
EP3SE260F1517I4N

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70 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FBGA (40x40)
Voltage - Supply0.86V ~ 1.15V
Number of I/ O976
Number of L A Bs/ C L Bs10200
Number of Logic Elements/ Cells255000
Total R A M Bits16672768
SeriesStratix® III E
Base Product NumberEP3SE260
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP3SE260F1517I4N is an IC (integrated circuit) component manufactured by Intel. It belongs to the Stratix III FPGA (Field-Programmable Gate Array) family. Here is an overview of the EP3SE260F1517I4N and its key features: 1. Programmable Logic: The EP3SE260F1517I4N is a powerful FPGA with a high-density programmable logic. It offers a range of logic elements, embedded memory blocks, and digital signal processing (DSP) blocks. 2. Stratix III Architecture: This IC component utilizes the advanced Stratix III architecture, providing high-performance features such as high-speed transceivers, dedicated external memory interface support, and efficient power consumption. 3. High-Speed Transceivers: The EP3SE260F1517I4N is equipped with high-speed transceivers, allowing it to handle high-speed data communication and signaling protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and others. 4. Embedded Memory: It includes various on-chip memory resources, including RAM blocks, FIFO (First-In-First-Out) buffers, and register files, allowing for efficient data storage and processing within the FPGA. 5. DSP Blocks: This IC component features dedicated DSP blocks that significantly enhance signal processing capabilities, making it ideal for applications involving digital filters, image and video processing, and wireless communication algorithms

In Stock: 70

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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