EP3C25F256C8

24624 1539 BGA-256 Programmable Logic Device (CPLDs/FPGAs)
part number has RoHS
1 : $201.6000

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Dasenic Part Number
5C63FA-DS
Manufacturer
Manufacturer Part #
EP3C25F256C8

Customer Reference

Datasheet
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905 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
BGA-256
Quantity
Unit Price
$ 201.6
Total
$ 201.6

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseFBGA-256
SeriesCyclone III
Number of I/ Os156
Mounting StyleSMD/SMT
Operating Supply Voltage1.15 V to 1.25 V
Maximum Operating Frequency315 MHz
PackagingTray
Minimum Operating Temperature0 C
Maximum Operating Temperature+ 70 C
Number of Logic Blocks1539
Embedded Block R A M E B R608 kbit
Distributed R A M608 kbit

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The EP3C25F256C8 is an Integrated Circuit (IC) component that offers advanced features and functionality suitable for a wide range of applications. Here is an overview of the key features and capabilities of this component: 1. High-Performance FPGA: The EP3C25F256C8 is a Field-Programmable Gate Array (FPGA) that delivers high performance and flexibility. It combines programmable logic elements and configurable I/O blocks to create custom digital circuits and implement complex logic functions. 2. Ample Logic Capacity: This IC component features a logic capacity of 25,000 Logic Elements (LEs). LEs are the fundamental building blocks of the FPGA and can be configured to perform Boolean operations, arithmetic calculations, and other logical functions. 3. Large Memory Resources: The EP3C25F256C8 provides significant memory resources to store data and configuration information. It includes 256 kilobits (32 kilobytes) of embedded memory blocks (or RAM) and also supports external memory interfaces for additional storage requirements. 4. High-Speed Interfaces: To enable fast communication and data transfer, this IC component offers a variety of high-speed interfaces. It includes multiple configurable I/O pins that can be customized to support various protocols such as LVDS, LVTTL, and SSTL. Additionally, it supports serial interfaces like SPI and I2C, allowing easy integration with other devices

In Stock: 905

MOQ
1PCS
Packaging
BGA-256
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 201.6
Total
$ 201.6

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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