EP2S60F672C3N

IC FPGA 492 I/O 672FBGA
part number has RoHS
1 : $283.5000

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Dasenic Part Number
EB428C-DS
Manufacturer
Manufacturer Part #
EP2S60F672C3N

Customer Reference

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3960 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
672-BBGA
Quantity
Unit Price
$ 283.5
Total
$ 283.5

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case672-BBGA, FCBGA
Supplier Device Package672-FBGA (27x27)
Voltage - Supply1.15V ~ 1.25V
Number of I/ O492
Number of L A Bs/ C L Bs3022
Number of Logic Elements/ Cells60440
Total R A M Bits2544192
SeriesStratix® II
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2S60F672C3N is a sophisticated IC (integrated circuit) component developed by Intel. It is a member of the Stratix II FPGA (Field-Programmable Gate Array) family, providing advanced programmable logic capability for various applications. Here are some key features and an overview of this IC component: 1. FPGA Technology: The EP2S60F672C3N utilizes FPGA technology, enabling users to configure the device according to their specific requirements. The FPGA architecture offers the flexibility of reprogramming the logic functionality, providing versatile adaptability. 2. High Capacity: This IC component is built with a high capacity of FPGA resources, offering sufficient logic elements, memory blocks, and digital signal processing (DSP) slices. It provides 58,848 logic elements, 2,160 embedded memory blocks, and 414 DSP slices, allowing for complex designs and computational operations. 3. High-Speed Interfaces: The EP2S60F672C3N supports several high-speed interfaces, including Gigabit Ethernet, PCI Express, Serial RapidIO, and various serdes channels. These interfaces enable seamless communication with other devices, enhancing connectivity capabilities. 4. Memory Features: The IC component incorporates various memory features, including embedded memory blocks (M4K) and dedicated memory interfaces. The embedded memory blocks offer multiple memory configurations, such as single-port or dual-port modes, enhancing data storage and retrieval functionality

In Stock: 3960

MOQ
1PCS
Packaging
672-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 283.5
Total
$ 283.5

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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