EP2S130F1020C3N

IC FPGA 742 I/O 1020FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
BBF4BE-DS
Manufacturer
Manufacturer Part #
EP2S130F1020C3N

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37 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1020-BBGA

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1020-BBGA, FCBGA
Supplier Device Package1020-FBGA (33x33)
Voltage - Supply1.15V ~ 1.25V
Number of I/ O742
Number of L A Bs/ C L Bs6627
Number of Logic Elements/ Cells132540
SeriesStratix® II
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2S130F1020C3N is an IC (integrated circuit) component produced by Intel Corporation. Offering a wide range of features and capabilities, this advanced component is specifically designed for high-performance applications. Here is an overview of its key features: 1. FPGA (Field-Programmable Gate Array) Technology: The EP2S130F1020C3N utilizes FPGA technology, allowing the user to configure the digital logic circuits within the component according to their specific requirements. This flexibility makes it suitable for a variety of applications. 2. High-Speed Performance: This IC component delivers high-speed performance, making it ideal for applications that require rapid data processing, such as advanced digital signal processing, image and video processing, and telecommunications. 3. Large Logic Capacity: With a logic capacity of 1,310,000 equivalent LEs (Logic Elements), the EP2S130F1020C3N can accommodate complex logic designs and enable the implementation of sophisticated algorithms. 4. Embedded Memory: The component incorporates 43,008 Kbits of embedded memory, which can be used for storage purposes within the FPGA, reducing the need for external memory devices and facilitating efficient data processing. 5. Extensive I/O Interfaces: The EP2S130F1020C3N provides multiple I/O (Input/Output) interfaces, enabling easy integration with various peripheral devices and external systems

In Stock: 37

MOQ
1PCS
Packaging
1020-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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