EP2AGZ225FF35I3N

IC FPGA 554 I/O 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
2808D9-DS
Manufacturer
Manufacturer Part #
EP2AGZ225FF35I3N

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33 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O554
Number of L A Bs/ C L Bs8960
Number of Logic Elements/ Cells224000
Total R A M Bits14248960
SeriesArria II GZ
Base Product NumberEP2AGZ225
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2AGZ225FF35I3N is an IC (integrated circuit) component manufactured by Intel. It belongs to the Arria II GX series of FPGAs (Field-Programmable Gate Arrays). This IC component is notable for its versatile capabilities and features that make it suitable for a wide range of applications. Here is an overview of its key features: 1. FPGA Technology: The EP2AGZ225FF35I3N utilizes FPGA technology, which allows for field-programmability and customization. This means that the circuit's functionality can be reconfigured even after the IC has been manufactured, offering flexibility and adaptability. 2. High Performance: The component is designed for high-performance applications, offering a balance between power efficiency and computational power. It is capable of processing complex algorithms and data-intensive tasks quickly and efficiently. 3. Logic Elements: The EP2AGZ225FF35I3N contains a total of 222,000 logic elements (LEs) that serve as configurable building blocks to implement various functions. LEs can be programmed to perform specific tasks, including mathematical operations, memory management, and digital signal processing. 4. Embedded Memory: This IC component features 660 embedded memory blocks, which can be used to store data locally within the FPGA. These memory blocks are configurable and can be adapted to meet the specific requirements of the application

In Stock: 33

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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