EP2AGX45DF25C6ES

IC FPGA 252 I/O 572FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
CA479C-DS
Manufacturer
Manufacturer Part #
EP2AGX45DF25C6ES

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

33 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
572-BGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case572-BGA, FCBGA
Supplier Device Package572-FBGA, FC (25x25)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O252
Number of L A Bs/ C L Bs1805
Number of Logic Elements/ Cells42959
Total R A M Bits3517440
SeriesArria II GX
Base Product NumberEP2AGX45
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for EP2AGX45DF25C6ES.
lauren@dasenic.com

Environmental & Export Classifications
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN3A001A2C
HTS US8542.39.0001
EU RoHS StatusRoHS Compliant
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2AGX45DF25C6ES is a powerful Integrated Circuit (IC) component that offers exceptional performance and versatility. It belongs to the Altera Arria II GX family and is built on a 40-nanometer process technology. Key Features: 1. FPGA: The EP2AGX45DF25C6ES features a Field-Programmable Gate Array (FPGA) that allows users to configure the device to suit their specific application needs. The FPGA architecture enables fast and flexible implementation of complex digital logic circuits. 2. Logic Capacity: This IC component offers a substantial logic capacity, making it suitable for a wide range of applications. It provides a generous number of programmable logic elements, registers, and embedded memory blocks, allowing for the implementation of complex designs. 3. High-Speed Transceivers: The EP2AGX45DF25C6ES also incorporates high-speed transceivers, enabling data transfer at exceptionally fast rates. These transceivers can support various protocols like PCI Express (PCIe), Gigabit Ethernet, Serial RapidIO, and more. 4. DSP Blocks: To handle signal processing tasks efficiently, this IC component includes Digital Signal Processing (DSP) blocks. These customizable blocks perform complex mathematical operations, making them ideal for applications such as digital filtering, audio/video processing, and telecommunications. 5. Memory Interfaces: The device provides versatile memory interfaces that support multiple standards, including DDR3, DDR2, and QDR-II+

In Stock: 33

MOQ
1PCS
Packaging
572-BGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04