EP2AGX45DF25C6

IC FPGA 252 I/O 572FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
F48ACA-DS
Manufacturer
Manufacturer Part #
EP2AGX45DF25C6

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

41 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
572-BGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case572-BGA, FCBGA
Supplier Device Package572-FBGA, FC (25x25)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O252
Number of L A Bs/ C L Bs1805
Number of Logic Elements/ Cells42959
Total R A M Bits3517440
SeriesArria II GX
Base Product NumberEP2AGX45
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for EP2AGX45DF25C6.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A991D
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2AGX45DF25C6 is an integrated circuit (IC) component manufactured by Intel. It belongs to the family of Arria II GX field-programmable gate arrays (FPGAs) and is known for its versatile and high-performance capabilities. Here are some key features and characteristics of this IC component: 1. FPGA Architecture: The EP2AGX45DF25C6 is based on a 40nm process technology and incorporates the advanced Arria II GX FPGA architecture. This architecture enables efficient and flexible implementation of complex digital systems. 2. Logic Elements: It offers a generous amount of logic elements, including around 44,880 adaptive logic modules (ALMs). These ALMs are programmable and can be configured to implement various logic functions. 3. Embedded Memory: The IC features a substantial amount of embedded memory, consisting of 810 Kbit of memory capacity. This memory can be used to store data or program code, providing high-speed access and reducing the need for external memory components. 4. High-Speed Transceivers: The EP2AGX45DF25C6 comes equipped with 16 full-duplex 3.75 Gbps transceivers. These transceivers facilitate high-speed data transfer and communication between the FPGA and external devices, such as other FPGAs, processors, or memory modules

In Stock: 41

MOQ
1PCS
Packaging
572-BGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04