EP2AGX260EF29C4N

IC FPGA 372 I/O 780FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
292710-DS
Manufacturer
Manufacturer Part #
EP2AGX260EF29C4N

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

46 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-FBGA (29x29)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O372
Number of L A Bs/ C L Bs10260
Number of Logic Elements/ Cells244188
Total R A M Bits12038144
SeriesArria II GX
Base Product NumberEP2AGX260
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for EP2AGX260EF29C4N.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A7A
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2AGX260EF29C4N is an Integrated Circuit (IC) component developed by Intel. It belongs to the Arria II GX series of Field Programmable Gate Arrays (FPGAs) and offers a range of powerful features. Here is a summary of its key features: 1. FPGA Architecture: The EP2AGX260EF29C4N is based on a 40nm process technology and offers a total of 260,000 logic elements. These logic elements can be configured and interconnected to create custom digital logic circuits. 2. High-Speed Serial Transceivers: This IC component supports up to 24 high-speed serial transceivers operating at data rates up to 6.375 Gbps. These transceivers enable high-speed communication with other devices or interfaces using protocols such as PCI Express, Serial RapidIO, and others. 3. Memory Interfaces: The EP2AGX260EF29C4N supports various memory interfaces, including DDR3, DDR2, QDRII+, and RLDRAM II. These interfaces allow the FPGA to interface with external memory devices, facilitating efficient data storage and retrieval. 4. Embedded Hard IP Cores: The FPGA includes various embedded hard Intellectual Property (IP) cores, such as transceivers, memory controllers, and processors. These cores provide ready-to-use functionality, reducing the need for additional circuitry and improving overall system performance

In Stock: 46

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04