EP20K200EFC672-3

IC FPGA 376 I/O 672FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
0030A6-DS
Manufacturer
Manufacturer Part #
EP20K200EFC672-3

Customer Reference

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30 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
672-BBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case672-BBGA
Supplier Device Package672-FBGA (27x27)
Voltage - Supply1.71V ~ 1.89V
Number of Gates526000
Number of I/ O376
Number of L A Bs/ C L Bs832
Number of Logic Elements/ Cells8320
Total R A M Bits106496
SeriesAPEX-20KE®
Base Product NumberEP20K200
PackagingTray

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Environmental & Export Classifications
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN3A001A2A
HTS US8542.39.0001
EU RoHS StatusRoHS Compliant
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP20K200EFC672-3 is an Integrated Circuit (IC) component manufactured by Altera Corporation. It is a Field Programmable Gate Array (FPGA) device that offers a range of functionalities suitable for various applications. Let's delve into the key features of this IC component: 1. Programmable Logic Elements: The EP20K200EFC672-3 integrates a large number of logic elements that can be configured and programmed as per the specific requirements of the application. This flexibility makes it highly versatile and adaptable to a wide range of designs. 2. Logic Array Blocks (LABs): This IC component incorporates multiple LABs, which consist of a collection of configurable logic blocks, registers, and interconnects. LABs can be interlinked to implement complex logic functions efficiently. 3. Embedded Memory: The EP20K200EFC672-3 offers a generous amount of embedded memory blocks, allowing users to incorporate various types of memory requirements into their designs. This eliminates the need for external memory components, simplifying the overall system design. 4. High-Speed Interfaces: To facilitate seamless communication with external devices, the IC component provides a range of high-speed interfaces. These interfaces include Serial Peripheral Interface (SPI), Inter-Integrated Circuit (I2C), and Universal Asynchronous Receiver/Transmitter (UART), among others

In Stock: 30

MOQ
1PCS
Packaging
672-BBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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