EP20K200EFC484-2X

IC FPGA 376 I/O 484FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
43BB78-DS
Manufacturer
Manufacturer Part #
EP20K200EFC484-2X

Customer Reference

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64 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
484-BBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case484-BBGA
Supplier Device Package484-FBGA (23x23)
Voltage - Supply1.71V ~ 1.89V
Number of Gates526000
Number of I/ O376
Number of L A Bs/ C L Bs832
Number of Logic Elements/ Cells8320
Total R A M Bits106496
SeriesAPEX-20KE®
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP20K200EFC484-2X is an IC (integrated circuit) component manufactured by the company Intel. It is a member of the Stratix II family of devices, designed for high-performance applications that require complex digital circuitry. Key Features of the EP20K200EFC484-2X: 1. FPGA Technology: It is based on Field Programmable Gate Array (FPGA) technology, which allows users to configure and customize the circuitry according to their specific requirements. 2. High-Density Logic: This IC component offers a high-density logic capacity of up to 200,000 equivalent logic elements (LEs), enabling the implementation of complex digital designs. 3. Speed Grade and Performance: The -2X speed grade ensures high operating frequencies, making it suitable for demanding applications that require fast computational capabilities. 4. Dual-Core Architecture: It features a dual-core architecture, allowing for parallel processing and increased performance for multi-threaded applications. 5. Embedded Memory: The EP20K200EFC484-2X includes embedded memory blocks, which can be used as multi-port RAM, ROM, FIFOs (First-In-First-Out), or even as digital signal processors (DSPs). 6. Enhanced I/O Capabilities: It offers a comprehensive range of I/O (input/output) options, including dedicated high-speed differential I/Os, robust LVDS (Low Voltage Differential Signaling) interfaces, and various standard I/O standards

In Stock: 64

MOQ
1PCS
Packaging
484-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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