5SGXEB6R1F43C2L

IC FPGA 600 I/O 1760FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
C5153B-DS
Manufacturer
Manufacturer Part #
5SGXEB6R1F43C2L

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41 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1760-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-FCBGA (42.5x42.5)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O600
Number of L A Bs/ C L Bs225400
Number of Logic Elements/ Cells597000
Total R A M Bits53248000
SeriesStratix® V GX
Base Product Number5SGXEB6
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGXEB6R1F43C2L is a powerful Integrated Circuit (IC) component developed by Intel. It belongs to the Stratix V family and offers advanced features to fulfill the requirements of high-performance applications. Here's an overview and key features of the 5SGXEB6R1F43C2L: 1. FPGA Architecture: The 5SGXEB6R1F43C2L utilizes a Field Programmable Gate Array (FPGA) architecture. FPGAs are highly flexible ICs that can be programmed and reprogrammed to execute various tasks, making them ideal for prototyping, accelerating computations, and implementing complex digital systems. 2. Transceiver Technology: It features industry-leading transceiver technology, enabling reliable and high-speed data transfer. These transceivers support various industry standards, such as PCIe Gen3, USB3.0, and 10 Gigabit Ethernet, making the IC suitable for applications requiring fast and reliable communication interfaces. 3. Logic Elements: The 5SGXEB6R1F43C2L consists of a large number of programmable logic elements, including Adaptive Logic Modules (ALMs), memory cells, and DSP blocks. These resources allow for efficient implementation of complex digital logic and arithmetic operations. 4. High-Speed Memory: The IC incorporates high-speed memory modules, such as embedded memory blocks (RAMs) and FIFOs (First-In, First-Out)

In Stock: 41

MOQ
1PCS
Packaging
1760-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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