5SGXEA5K2F35I2LN

IC FPGA 432 I/O 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
BE7B3B-DS
Manufacturer
Manufacturer Part #
5SGXEA5K2F35I2LN

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75 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O432
Number of L A Bs/ C L Bs185000
Number of Logic Elements/ Cells490000
Total R A M Bits46080000
SeriesStratix® V GX
Base Product Number5SGXEA5
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component 5SGXEA5K2F35I2LN is a highly advanced and powerful integrated circuit device manufactured by Intel's Altera division. It belongs to the Stratix V family of field-programmable gate arrays (FPGAs) and offers a multitude of features and capabilities for various applications. Key features of the 5SGXEA5K2F35I2LN IC component include: 1. FPGA Architecture: The 5SGXEA5K2F35I2LN utilizes a 28 nm high-performance FPGA architecture, allowing for efficient and fast processing. 2. Logic Elements: It consists of 5,110,000 logic elements, which are the basic building blocks of an FPGA. These elements can be programmed to perform a wide range of digital functions. 3. Embedded Memory: The component incorporates 5,010,000 adaptive look-up tables (ALUTs) for implementing logic functions and 12,776 M20K memory blocks for efficient storage. 4. High-Speed Interfaces: It supports various high-speed interfaces such as PCIe Gen2 x8, 10 Gigabit Ethernet, Serial RapidIO, and more, enabling seamless connectivity with other devices. 5. Low-Power Consumption: The IC component is designed with power efficiency in mind, utilizing advanced power management features to minimize power consumption while maintaining high performance

In Stock: 75

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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