5SGSMD4E3H29I3N

IC FPGA 360 I/O 780HBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
97554F-DS
Manufacturer
Manufacturer Part #
5SGSMD4E3H29I3N

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

993 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseBGA-780
SeriesStratix V GS
Number of I/ Os360
Mounting StyleSMD/SMT
PackagingTray
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
Number of Logic Blocks957
Distributed R A M19 Mbit

Kindly contact our sales Rep to obtain the data you desire for 5SGSMD4E3H29I3N.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The IC component 5SGSMD4E3H29I3N belongs to the Stratix V family of field-programmable gate arrays (FPGAs) manufactured by Intel. It is a high-performance device designed for various applications such as data center acceleration, network infrastructure, high-performance computing, and broadcasting. Key Features of the 5SGSMD4E3H29I3N include: 1. FPGA Architecture: The 5SGSMD4E3H29I3N utilizes the Intel Cyclone V FPGA architecture, which provides high logic density, high-performance transceivers, and low power consumption. 2. Logic Density: It offers a significant amount of programmable logic elements (LEs), allowing for complex designs and implementation of various functions. 3. Transceiver Technology: This IC component includes high-speed transceivers supporting protocols such as PCI Express Gen3 x8, Interlaken, 10/40/100 Gbps Ethernet, and Serial RapidIO. 4. High-Speed Interfaces: The device is equipped with multiple configurable I/O banks, supporting a wide range of voltages and standards such as LVDS, DDR3 memory interfaces, and programmable I/O standards. 5. DSP Blocks: It incorporates abundant digital signal processing (DSP) blocks, enabling efficient implementation of mathematical functions, filtering, and signal processing algorithms

In Stock: 993

MOQ
1PCS
Packaging
780-BBGA, FCBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04