5SGSMD3H2F35C2LN

IC FPGA 432 I/O 1152FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
4A4862-DS
Manufacturer
Manufacturer Part #
5SGSMD3H2F35C2LN

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

28 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O432
Number of L A Bs/ C L Bs89000
Number of Logic Elements/ Cells236000
Total R A M Bits13312000
SeriesStratix® V GS
Base Product Number5SGSMD3
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for 5SGSMD3H2F35C2LN.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGSMD3H2F35C2LN is a high-performance integrated circuit (IC) component developed by Intel under its Stratix V series. It belongs to the 28 nm FPGA (Field-Programmable Gate Array) family and offers a wide range of features for various applications. Here are some key features of this IC component: 1. FPGA Architecture: The 5SGSMD3H2F35C2LN utilizes a complex programmable logic device architecture, allowing users to configure the chip to meet their specific application requirements. It provides a flexible and customizable platform for hardware development and acceleration. 2. Logic Capacity: This IC component has a substantial logic capacity, providing ample resources to implement complex digital designs. It offers around 221,000 logic elements (LEs), which are building blocks for implementing digital circuits. 3. DSP Performance: The 5SGSMD3H2F35C2LN incorporates dedicated digital signal processing (DSP) blocks, which enable efficient and high-performance signal processing capabilities. It provides approximately 1,430 DSP blocks, each capable of performing multiply-accumulate operations, making it suitable for applications like image and signal processing. 4. High-Speed Transceivers: To facilitate high-speed data communication, this component includes built-in transceivers that support various protocols. It comprises 33 transceivers with multi-gigabit capabilities, allowing for fast data transfer and communication between different components

In Stock: 28

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04